Astrium Space Transportation ATV O S O D Issue : Revision : Date …emits.sso.esa.int/emits-doc/ESTEC/AO6337_AD3_ATV_AS_SSS... · 2010-01-13 · Internal Ref. : T031 n° 123 975 Page

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ATV - AS - SSS - 3300

Issue : 6 Revision : A Date : 22/03/2007 Class : 2 Category : 1 DRD: ENG-08 Product Tree Code : A Internal Ref. : T031 n° 123 975 Page : 1

EMC SPECIFICATIONS AND DESIGN REQUIREMENTS

POWER QUALITY

ATV Programme Manager

N. CHAMUSSY

Astrium Space Transportation Orbital Systems and Operations Directorate


ATV

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ATV 05-03


Internal reference : T031 n° 123 975 Date : 22/03/2007

Structural reference : ATV - AS - SSS - 3300

Issue 6

Revision A Page 4/109

CLASSIFICATION CONTRACT

Company EADS-LV unprotected

EADS-LV Reserved

Military Unclassified (NP)

Restricted (DR)

Programme General Public (1)

Industry (2)

Customer ESA

Contract number

Programme ATV

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EADS-LV Secret Confidential (CD)

Secret (SD) Restricted (3)

Confidential (4) Contractual document

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TITLE EMC SPECIFICATIONS AND DESIGN REQUIREMENTS - POWER QUALITY

ABSTRACT This document defines the EMC specifications applicable to ATV units, ATV interfaces and EGSE. So are preliminarily given the design requirements applicable to ATV components and the power quality requirements coherent with these specifications.

KEYWORDS EMC - I/F - POWER SYSTEM - DESIGN REQUIREMENTS File reference : ATV-AS-SSS-3300-5A Software : WORD 97 Configuration management Distribution category

Language code : EN Language taking precedence :

None Internal

Interest Short term Medium or long term

figures appendices Customer Suppl. distribution Authorized Checked

VISAS Sigle

Author

Controller

Quality SL/QV

Head of Department. SY/YC

Name T. SERDIN P. FARFAL Signature

IPS 05-01

Configurated and signed document issue 4/B


ATV ISSUES/REVISIONS STATUS RECORD

YY/CE n° 123 975

Document Programme

Reference ATV - AS - SSS - 3300

page n° 5

Issue and revision n° Date

Reasons for document change: Pages changed, added, deleted, CRN

(+ paragraphs nb concerned in case of revision) Document validity status (reference and date)

Issue 1

Revision A 27.06.1997 Original issue

Issue 2 Revision A 02.04.1998

Merging of SSS-1300 and SSS-3300 Taken into account of SRR2 actions n° 48, 80, 81, 82, 87, 89, 93, 114, 119, 151, 152

Issue 3 Revision A 03.08.1998

SSS-3300 becomes an EMC and power quality specific document. Non-EMC design requirements and signal I/F control are subject of SSS-1300

Issue 4 Revision A 17.02.1999 Taken into account ESA and co-contractor remarks.

Issue 4 Revision B 01.03.2000

Taken into account ESA and co-contractor remarks for PDR Modified power supply conditions between ISS-RS I/F and PCDU (p26-p27-p28-p30). Modified grounding/isolation requirements of primary power network and signal I/F (p12-p16-p18). Generic EMC verification approach added (p8-p67& follow.) Re-wording without modification for better understanding (p31-p38-p42). Changed test procedures associated to CW conducted susceptibility test specifications (p37-p63-p64)


Issue 5 Revision A

New issue taking into account the document change notice of CP1238: up-dating of SSS3300 in order to introduce new ESA requirements (issue 2 of RQ014) and DOORS format.

Issue 6

Revision A 22/03/2007

New issue taking into account the document change notice DCN3316: up-dating of SSS3300 in order to introduce some requirement suppressions and formal corrections, both without consequences on the design nor qualification process. This issue 6 is the reference for the E phase. The following modifications have been done :

o suppression of requirement 930 (connector potting) (FS QR1 action)

o requirement 1350 : typing error correction of “Hz”

o requirement 1450 : correction of the capacitor value, in line with figure5.5/7; extension of the set-up resistor and capacitor values in line with ATV ESA RQ014

o correction of figure 4.2.1.4/1 (RS-SM LISN common mode impedance ) in order to be in line with set-up described in figure 5.1/2

o requirement 1520 & 1530 : relaxation of the requirement on inrush current limit in order to be in line with ATV ESA RQ014

o requirements 1550 & 1555 : typing error correction of injection rate; limitation of the requirement to the calibration phase

o requirement 1640 : typing error correction of the ATV PROX Emission frequency (2205 instead of 2250)

ATV 05-03

ATV - AS - SSS - 3300 Issue 6 - Revision A

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Contents 1. INTRODUCTION............................................................................................................................................................................................................................................... 10

1.1 PURPOSE ....................................................................................................................................................................................................................................................... 10 1.2 APPLICABLE DOCUMENTS ............................................................................................................................................................................................................................. 13 1.3 REFERENCE DOCUMENTS ............................................................................................................................................................................................................................... 13 1.4 ABBREVIATIONS AND ACRONYMS.................................................................................................................................................................................................................. 14

2. EMC-RELATED DESIGN REQUIREMENTS............................................................................................................................................................................................... 16 2.1 MODULE REQUIREMENTS .............................................................................................................................................................................................................................. 16

2.1.1 System grounding concept ....................................................................................................................................................................................................................... 16 2.1.2 System bonding concept ........................................................................................................................................................................................................................... 19 2.1.3 Module shielding...................................................................................................................................................................................................................................... 23 2.1.4 EMC-relevant signal design drivers ........................................................................................................................................................................................................ 24

2.2 UNIT REQUIREMENTS .................................................................................................................................................................................................................................... 25 2.2.1 Unit grounding/isolation.......................................................................................................................................................................................................................... 25 2.2.2 Unit bonding ............................................................................................................................................................................................................................................ 31

2.3 HARNESS REQUIREMENTS ............................................................................................................................................................................................................................. 34 2.3.1 Categorization.......................................................................................................................................................................................................................................... 34 2.3.2 Routing & layout...................................................................................................................................................................................................................................... 35 2.3.3 Harness shielding..................................................................................................................................................................................................................................... 36 2.3.4 Harness connectors.................................................................................................................................................................................................................................. 39

3. POWER QUALITY REQUIREMENTS .......................................................................................................................................................................................................... 40 3.1 REGULATED POWER BUS CHARACTERISTICS (SYSTEM LEVEL) ...................................................................................................................................................................... 42

3.1.1 Power bus quality .................................................................................................................................................................................................................................... 42 3.1.2 Solid state power controllers ................................................................................................................................................................................................................... 44

3.2 INDUCED REQUIREMENTS AT EQUIPMENT POWER I/F (UNIT LEVEL) .............................................................................................................................................................. 47 3.2.1 Steady state voltage range ....................................................................................................................................................................................................................... 47 3.2.2 Power consumption requirements............................................................................................................................................................................................................ 48 3.2.3 Inrush current .......................................................................................................................................................................................................................................... 48 3.2.4 Relay sizing .............................................................................................................................................................................................................................................. 48 3.2.5 Power I/F circuit design .......................................................................................................................................................................................................................... 49 3.2.6 EMC performance.................................................................................................................................................................................................................................... 49 3.2.7 Source impedance .................................................................................................................................................................................................................................... 50

4. EMC SPECIFICATIONS .................................................................................................................................................................................................................................. 51 4.1 EQUIPMENT/ASSEMBLY USING ATV PRIMARY REGULATED 28V. BUS....................................................................................................................................................... 51

4.1.1 Conducted emissions................................................................................................................................................................................................................................ 52


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4.1.2 Radiated emissions................................................................................................................................................................................................................................... 54 4.1.3 Magnetic cleanliness................................................................................................................................................................................................................................ 57 4.1.4 Conducted susceptibility .......................................................................................................................................................................................................................... 57 4.1.5 Radiated susceptibility ............................................................................................................................................................................................................................. 64 4.1.6 Electrostatic discharge susceptibility....................................................................................................................................................................................................... 66 4.1.7 Lightning stroke susceptibility ................................................................................................................................................................................................................. 67 4.1.8 Susceptibility to micro cut-off .................................................................................................................................................................................................................. 67 4.1.9 Corona effect............................................................................................................................................................................................................................................ 68

4.2 EQUIPMENT/ASSEMBLY USING ISS-RS POWER I/F LINES ............................................................................................................................................................................. 68 4.2.1 Power input requirements ........................................................................................................................................................................................................................ 68 4.2.2 Conducted emission ................................................................................................................................................................................................................................. 70 4.2.3 Radiated emissions................................................................................................................................................................................................................................... 73 4.2.4 Conducted susceptibility .......................................................................................................................................................................................................................... 74 4.2.5 Radiated susceptibility ............................................................................................................................................................................................................................. 78 4.2.6 Electrostatic discharge susceptibility....................................................................................................................................................................................................... 78 4.2.7 Lightning stroke susceptibility ................................................................................................................................................................................................................. 78 4.2.8 Susceptibility to micro cut-off .................................................................................................................................................................................................................. 78 4.2.9 Corona effect............................................................................................................................................................................................................................................ 78

4.3 FLIGHT CONFIGURATION ............................................................................................................................................................................................................................... 79 4.3.1 I/F definition ............................................................................................................................................................................................................................................ 79 4.3.2 Intra system compatibility ........................................................................................................................................................................................................................ 81 4.3.3 Inter system compatibility ........................................................................................................................................................................................................................ 82

4.4 EGSE............................................................................................................................................................................................................................................................ 87 4.4.1 Design requirements ................................................................................................................................................................................................................................ 88 4.4.2 Power bus characteristics ........................................................................................................................................................................................................................ 88 4.4.3 Conducted emissions................................................................................................................................................................................................................................ 88 4.4.4 Radiated emissions................................................................................................................................................................................................................................... 90

5. EMC GENERAL TEST SET UP....................................................................................................................................................................................................................... 90 5.1 TEST FACILITY REQUIREMENTS ..................................................................................................................................................................................................................... 90 5.2 TEST GUIDELINES .......................................................................................................................................................................................................................................... 93 5.3 TEST EQUIPMENT REQUIREMENTS ..................................................................................................................................................................................................... 95

5.3.1 Receiving equipment ................................................................................................................................................................................................................................ 95 5.3.2 Signal sources .......................................................................................................................................................................................................................................... 95 5.3.3 Test antennae ........................................................................................................................................................................................................................................... 95 5.3.4 Miscellaneous test equipment .................................................................................................................................................................................................................. 98

5.4 TEST SET UP FOR EMISSION MEASUREMENT................................................................................................................................................................................................... 99 5.4.1 CEP (Conducted Emission Primary power lines).................................................................................................................................................................................... 99 5.4.2 CECM (Conducted Emission) secondary power lines or signals........................................................................................................................................................... 100


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5.4.3 RE E (Radiated Emission, E field) ......................................................................................................................................................................................................... 101 5.5 TEST SET UP FOR SUSCEPTIBILITY TESTS..................................................................................................................................................................................................... 102

5.5.1 CSP conducted susceptibility, power lines............................................................................................................................................................................................. 102 5.5.2 Common mode susceptibility tests ......................................................................................................................................................................................................... 106 5.5.3 RS E radiated susceptibility, E field....................................................................................................................................................................................................... 107 5.5.4 ESD (electrostatic discharge tests) ........................................................................................................................................................................................................ 108

6. GENERIC EMC VERIFICATION APPROACH ......................................................................................................................................................................................... 109

This document is the property of EADS LAUNCH VEHICLES and shall not be communicated to third parties and/or reproduced without prior written agreement. Its contents shall not be disclosed. © - EADS LAUNCH VEHICLES - 2002

ATV-AS-SSS-3300-6.A.doc

SYSTEM SUPPORT SPECIFICATION ATV-AS-SSS-3300

Issue:6 Rev :A Page: 10 /109

Verification Level EQ: Equipment SS: Subsystem EL: Element SYS: SystemVerification Method FT: Flight Test T: Ground Test A: Analysis I: Inspection R: Review of Design N: Not to be tracked

EQ SS EL SYS

1. INTRODUCTION

1.1 PURPOSE

This document specifies the EMC performances and defines the coherent design requirements that are applicable at equipment level and at system level in order to ensure the intra-ATV vehicle electromagnetic compatibility and the compatibility with the interfaced systems during each operational life cycle:

• ground operations,

• launch phase,

• free flight configuration,

• docked operations.

The external interfaces are identified as follows and constitute the basis of the electromagnetic environment of ATV system:

• EGSE Conducted interference on power lines, grounding/isolation of monitoring signals, commands, data streams.

• Launch Pad (ELA3) Transmitters and receivers on launch Site.

• Launcher (ARIANE 5) Structural bonding and radiated environment.

• Relay Satellites (TDRSS) S-Band forward and return link frequencies.






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• GPS L-Band receiving frequency.

• ISS Overall radiated environment including EVA and S-band proximity link with RS-SM. Conducted interference on power lines, grounding/isolation of monitoring signals, commands and data busses during attached mode.

Such a so large document purpose must be thematically organised to be easily used by equipment manufacturers as well as system integrator.

Design requirements (refer to § 2) limited to EMC related ones (grounding, bonding, shielding, filtering, I/F common mode coupling, and protection) are split into three product oriented domains:

• module itself,

• equipment,

• harness,

so stressing the level at which these requirements must be verified.

As a preliminary to EMC specification, Power quality requirements (refer to § 3) are the purpose of the following paragraph.

Then are defined the EMC specifications (refer to § 4) which apply to ATV Flight Segment and EGSE, i.e the associated system under ESA responsibility.






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Flight Segment specifications are split into three parts.

• 4.1 Equipment/assembly using ATV primary regulated 28V bus, and

• 4.2 Equipment/assembly using ISS-RS power lines

to control intra system’s compatibility based on unit qualification.

• 4.3 Flight configuration specification,

to control inter system compatibility, especially with ISS-RS segment.

At last the EMC verification paragraphs, which are not the least important in EMC control programme, define the general test set-up’s and procedures (refer to § 5) when test verification methods apply; the requirement verification methods and their applicability matrix (refer to §6), being the purpose of the DOORS format and so proposed all along the document.






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1.2 APPLICABLE DOCUMENTS

[AD1] MIL-STD-462 -31.1.67 Measurement of EMI characteristics [AD2] MIL-STD-462 D -11.1.93 Measurement of EMI characteristics [AD3] ATV-AS-RQ070 - Volume 9 (Part Application Analysis) (2/A) ATV-EEE Component Policy [AD4] RTCA DO 160D / EUROCAE ED 14D Environmental conditions and test procedures for airborne equipment (section 22 lightning induced transient susceptibility)

1.3 REFERENCE DOCUMENTS

[RD1] ATV-AS-SSS-3100 (2/B) ATV system support specification electro-pyrotechnic systems general specification [RD2] ATV -ESA-RQ-014 ATV EMC & power quality [RD3] ATV-AS-SSS-1300 (3/A) Avionics general design and interface requirements






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1.4 ABBREVIATIONS AND ACRONYMS AIT : Assembly, Integration and Test

ETM : Electrical Test Model

PFM : ProtoFlight Model

EGSE : Electrical Ground Support Equipment

ELA3 : Ensemble de LAncement 3 GPS : Global Positioning System

TDRSS : Tracking Data Relay Satellite System

ISS : International Space Station

RS-SM : Russian Segment - Service Module

PCDU : Power Control and Distribution Unit

SE : Shielding Effectiveness

RF : Radio Frequency

LF : Low Frequency

TM : TeleMetry

AM : Amplitude Modulation

RR : Répondeur Radar (Radar transponder)

TCN : TéléCommande de Neutralisation

PCB : Printed Circuit Board






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DC,dc : Direct Courant

BW, RBW: BandWidth, Resolution BandWidth

I/F : InterFace

S/S : SubSystem

Voc : Open Circuit Voltage

Vp : Peak Voltage

RMS,rms : Root mean square

LISN : Line Impedance Simulation Network

QP,qp : Quasi-peak

RFS : Refueling System

UUT,EUT : Unit Under Test






EQ SS EL SYS

2. EMC-RELATED DESIGN REQUIREMENTS

2.1 MODULE REQUIREMENTS

2.1.1 System grounding concept

10 a) The grounding concept is illustrated in figure 2.1.1/1 which features a Distributed Single Point Grounding system (DSPG). Each unit shall have its own electrical reference locally grounded to the ATV module structure and isolated from the primary power.

R R

20 b) The electrical links which ensure the I/F between the different units require at the input side, electrical isolation (galvanic isolation, opto-coupler or differential receiver) and common mode rejection as defined § 4.1.4.3.3.

R R






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P rim a ry P o w e r

V C M

-+

V C MVCM

EU R OS AV 675

2.1.1.1 Power I/F

30 a) The primary power bus shall be grounded, at one location, to ATV vehicle structure. R R R

40 b) Each primary 0 V is referenced to the ATV vehicle ground reference by a single point, placed inside the PCDU. This grounded point shall be designed to withstand a fault current equal to battery short circuit (at least 200 A).

R R

FIGURE 2.1.1/1

GROUNDING CONCEPT






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50 c) When a single converter supplies one or several pieces of equipment, the secondary power network shall be grounded at a single point within the equipment containing the converter (this grounding point can be distributed inside this equipment).

R R

60 d) All secondary power Subsystems shall isolate primary power from secondary power with a DC/DC converter. R R

2.1.1.2 Signal I/F

70 a) Signal circuit interfacing between equipment shall follow the distributed single point grounding concept. R R

80 b) Two wire interfaces shall be used. R R

90 c) Signal interfaces shall not use primary power return as reference. R R

100 d) Signal output shall be referenced to box structure via secondary 0 V reference. R R

110 e) No equipment shall depend on other equipment for signal reference or signal return grounding unless, it is also dependent upon the other equipment for its signal active line (positive).

R R






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2.1.1.3 EGSE I/F

120 a) Ground test equipment shall be isolated from ATV vehicle ground reference either with galvanic isolation, opto coupler or differential transceivers (as relevant).

R

130 b) Harness segregation policy can be alleviated when applied to EGSE links. N

2.1.2 System bonding concept

2.1.2.1 Basic requirements

140 a) Bonding connections shall be installed such that no vibration, expansion, contraction or relative movement incident to normal service use, will not break nor loose the connection to such an extent that the resistance will vary during the movement.

I I

150 b) Wherever dissimilar metals are in direct contact, they shall be chosen to avoid having electrolytic couple. Metallic surfaces subject to oxidation shall, as minimum, receive a protective coating or surface treatment in the vicinity of all assembly points. Protective coating and/or surface treatments shall not degrade the electrical continuity between surfaces in contact.

I/R I/R

160 c) Direct metal-to-metal contact by surface bonding shall be preferred. I I

170 d) For ESD control, the resistance between any space exposed surface and structure shall be less than 100 kΩ. T T






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180 e) All metallic part, whatever the location and extent are, shall be bonded to structure so as to avoid differential

charge build up. I/T I/T

2.1.2.2 ATV vehicle structure metallisation

190 a) Ground Reference Point (GRP) shall be available by each sub-assembly. From structure with 2 ground reference points the DC resistance between two reference points shall be lower than 5 mhom.

I/T I/T

200 b) These GRP shall be easily accessible in order to make the 4 point measurement probes easy to handle. I I

210 c) The electrical resistance measured between two GRP from two adjacent structures shall be lower than 5 mhom. T

220 d) The ATV vehicle structure shall be electrically connected to the launcher which is grounded. The resistance between the lower GRP and the nearest launcher GRP shall be lower than 10 mhom.

A

230 e) All metallic elements belonging to the structure shall present w.r.t GRP a resistance:

• < 5 mhom for external structure having electrical function (including bonding strap, if used),

• < 5 mhom for internal structure having electrical function (including bonding strap, if used).

T T T






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240 f) The mechanical, pneumatic, hydraulic devices, like motors, pipes or valves, fitted out with measurement sensors shall have at all points a resistance w.r.t GRP lower than 500 mhom.

T T

250 g) All metallic members of the structure shall be electrically bonded by direct metal-to-metal contact (preferred method) or bonding strap.

I I I

260 h) All structural parts and bonding interfaces shall be able to carry at least 100 A. A A

270 i) Metallic parts without electrical function shall have a bonding resistance of 50 Ω DC maximum between adjacent parts.

T T

2.1.2.3 Metallisation of non-metallic parts

280 a) All non metallic structure part supporting an equipment shall provide a ground reference plan, in order to fix the equipment onto a metallic surface. This ground plan shall be continue between equipment connected by a harness.

I I

290 b) This ground reference plan shall be bonded to the ATV vehicle structure with a resistance lower than 5 mhom. T T






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300 c) Metal-carbon composite and carbon composite-carbon composite ATV structural assemblies:

• the techniques used for metal-carbon composite and carbon composite-carbon composite assemblies shall ensure a contact resistance not exceeding 1 Ω DC when measured as close as possible to the assembly area.

• It is not permitted to use CFRP items as bonding path.

I/T T/I

310 d) All non metallic, external, skin shall have a surface resistance comprised between 105 Ω per square < Rs < 108 Ω per square.

T T

320 e) All discontinuity on the anti-static paint or all non painted area > 100 cm2, shall be eliminated by adding metallic conductors in several points to keep the resistance value between painted area in the same range of Rs.

I/T I/T

330 f) The grounding of the anti-static paint shall be a multiple point one and must be done, as far as possible, with surface contacts than point contacts.

I/T I/T

2.1.2.4 Solar array panels

340 a) Solar array panels are isolated from each other before electrical connection. T T

350 b) Each solar array panel shall be connected to the ATV structure through grounding lines by redundant resistors leading to a grounding resistance of 25 kΩ to 50 kΩ per panel.

T T






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360 c) In order to achieve a conductive outer surface of the ATV vehicle, the sheet resistance of materials of any outside surface shall be less than 100 kΩ per square. However, cerium doped glass can be used for the solar panel front covers.

T T

2.1.2.5 Multi layer insulation

370 a) Each layer of Multi-Layer Insulation (MLI) shall be connected to structure with at least two reference points. The DC resistance between this reference point and structure shall be less than 1 Ω.

T T

380 b) Each plated foil shall be electrically connected to the reference point of the MLI. The DC resistance between any point of the plated foil and the bonding point shall achieve at least 50 Ω.

T T

2.1.3 Module shielding

Even if not guaranteed by SE specification basic design requirements are specified to implement a controlled shielding effect.

390 a) Apertures shall be minimised in quantity and size and shall be fitted out with special RF screen (e.g. honeycomb or

mesh cover). I/R I/R

400 b) The overall shielding passing through harness shall be circumferentially bonded at structure module crossing point (feed-through connectors are recommended).

I I






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2.1.4 EMC-relevant signal design drivers

410 a) As a general rule, all bi-level and digital signal interfaces shall be of a low level type (i.e. standard 5 V signal). R R

420 b) Maximum effort shall be put into designing signal interfaces to withstand noise environments and not to produce excessive noise. A proper signal I/F design reduces to a great extent system susceptibility.

R R

430 c) Nominal voltage rate of change of signals shall be adapted to data bit rate at circuit driver level: as a general design rule, rise time and fall time of I/F circuit drivers shall be kept to a value (at 10%; 90% of pulse amplitude) larger than 1/10 of nominal bit width, with a maximum upper limit of 1/3 of nominal bit width.

R R






EQ SS EL SYS

2.2 UNIT REQUIREMENTS

2.2.1 Unit grounding/isolation

Vs

- Vs

EQUIPMENT

rimarypower

Vp

0 Vp

ondingstud

Secondarygroundplane

EUROSAV 4815

0 Vs

0 Vs

DC / DCCONVERTER

S/C STRUCTURE

EQUIPMENT HOUSING

FIGURE 2.2.1/1

EQUIPMENT GROUNDING






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2.2.1.1 Primary power

440 a) Each user of primary power shall isolate the power wires (go and return) from structure by more than 2 MHOM shunted by a capacitor of less than 50 nF.

T

450 b) The requirement is valid when all I/F circuits are connected with the intended grounding configuration. I

460 c) Power line interfaces from different primary power distribution outlets shall be designed to galvanically isolate the primary power lines by at least 1 MHOM from each other at the user side.

T

2.2.1.2 Secondary power

470 a) Each Unit shall exhibit between primary and secondary power circuits an isolation impedance of more than 2 MHOM shunted by a capacitor of less than 50 nF (under 50 V) when the ground contact is disconnected.

T

480 b) In order to decrease common mode EMI sources, a low impedance path shall be used inside the unit for all 0 V electrical connections between boards. The secondary 0 V shall be grounded with a resistance value lower than 10 mhom.

R/T

490 c) Use of 0 V grounding plane shall be used as far as possible, in order to minimise stray inductance and loop area. R






EQ SS EL SYS

500 d) The secondary power reference, located at power transformer secondary winding level, shall be connected to equipment housing throughout the lowest inductive path. The ground reference shall not be routed via equipment connector.

R

510 e) The grounding from secondary power return to chassis is not allowed where an isolated secondary voltage is referenced to primary power return (e.g. for control purposes).

R

520 f) Secondary power referenced to primary power return shall not be used by other loads and signal interfaces. R

530 g) When a single converter supplies one or several other equipment the secondary power network shall be grounded at a single point within the equipment containing the converter.

R

540 h) Redundancy shall be provided; preferably through multiple connections of the secondary ground reference plane (PCB) to the mechanical structure. The current carrying capability of these grounding connections shall be larger than the worst case fault or failure current inside the equipment, including faulty short circuit of pins to structure or a lost of isolation w.r.t. structure (refer to figure 2.2.1/1).

R

2.2.1.3 Signal I/F

Single ended interfaces

550 a) Where single-ended signal sources are used, i.e. signal return and ground reference are interconnected, the signal destination shall isolate the signal lines from box structure (differential amplifier, opto-coupler, solid state relay, transformer).

R R






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560 b) Where the signal source is completely isolated, e.g. relay palet, opto-coupler, transformer, the destination shall

not be isolated and can be single ended. R R

570 c) In both cases an isolation according to figure 2.2.1.3/1 shall be maintained at the floating port, for the nominal operating frequency range of the signal I/F.

T T

Differential interfaces

580 d) Differential links shall be used preferentially for all signal interfaces, either analog or digital. R R

590 e) Line-driver/line-receiver type interfaces shall be differential and except where otherwise stated, are required to meet isolation of figure 2.2.1.3/1.

R/T R/T






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0,01

0,1

1

10

100

1000

1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08

F (Hz)

Z Is

olat

ion

(kO

hm)

HF interfaces

600 f) High frequency interfaces (with fundamentals beyond 30 MHz) are exempt from the single-point ground system where the use of coax cables or wave guides is necessary.

R R

FIGURE 2.2.1.3/1

COMMON MODE SIGNAL ISOLATION IMPEDANCE






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Cross-strapped links

610 g) The DSPG policy shall be maintained in any case with the same isolation impedance target. As a consequence:

• redundant receivers sharing a common signal from the same driver shall not be a single-ended one (refer to figure 2.2.1.3./2),

• redundant emitters sharing a common signal toward the same receiver shall be double-ended drivers (refer to figure 2.2.1.3./3).

R/T R/T

FIGURE 2.2.1.3/2 CROSS STRAPPED LINK #1






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2.2.2 Unit bonding

2.2.2.1 Unit housing

620 a) Each unit shall be housed in a non magnetic (i.e. µr = 1) metallic case which shall form an electromagnetic shield containing the fields generated by the electrical operation of the unit.

R/I

630 b) The case shall not contain any apertures other than those essential for sensor viewing or outgassing vents. I

A

EUROSAV 4818

B

FIGURE 2.2.1.3/3

CROSS STRAPPED LINK #2

A

EUROSAV 4818

B

FIGURE 2.2.1.3/3

CROSS STRAPPED LINK #2






EQ SS EL SYS

640 c) If outgassing vents are required they should be as small as possible (less than 5 mm diameter) and should be located on the box face which is closest to the equipment shelf (ATV vehicle structure ground). If 5 mm diameter is too small the holes shall be fitted with equivalent wire mesh.

I

650 d) Where case parts are joined by means which do not maintain a continuous joint, (e.g. by screws, rivets, spot welds etc.) as a guideline, the distance between adjacent bond points shall not exceed 25 mm and overlap shall be achieved.

I

660 e) Joint faces shall be flat and clean before assembly; the only permitted surface finishes for joint faces are:

• clean metal except aluminium,

• gold plate on the base metal,

• alodine 1200,

• any other anti corrosion finish, e.g. anodising, shall be removed from the joint faces before bonding,

• aluminium (except moderate or high copper Al alloy) or magnesium which oxides within a few seconds, requires a special conductive treatment before bonding.

I

670 f) Electrical connectors are to be considered as part of the case; all connectors shall include a metallic outer shell such that when the mating cable harness connector is inserted in the box mounted part the whole connector is completely shielded. The shell of the box mounted part shall be bonded to the equipment case as required by this specification.

R/I






EQ SS EL SYS

2.2.2.2 Bonding requirements

680 a) The degradation can be expected for a long life time (storage or other). The specified values are intended as measured at beginning of life. In the EMC control plan the degradation, related to the required life time, shall be assessed and the impact on safety margin evaluated, at least for the main structural connections.

A

2.5 m Ω

2.5 m Ω

A TV vehicle S tructure

Equipm entStructure

structureG R P

Equipm entgrounding stud

Equipm entgrounding strap

7.5 m Ω

structuregrounding

5 m Ω

Equipm entC onnector

2.5 m Ω

10 m Ω5 m Ω

H arness shield

structuregrounding

10 m Ω

690 b) The case shall ultimately be grounded to the ATV vehicle structure. The grounding point should be a stud M4 x 8

(TBC) located near but not less than 20 mm above the mounting plane. The stud shall be easily accessible when the unit is integrated on the ATV vehicle.

I

700 c) The ground strap shall be placed and easily accessible, when the unit is integrated on the ATV vehicle. I

FIGURE 2.2.2.2/1 EQUIPMENT/HARNESS

BONDING REQUIREMENT






EQ SS EL SYS

710 d) The current capability of the ground strap shall be larger than the maximum fault current expected to be derived into the equipment structure.

This value being defined by 150% of the largest short circuit current of the secondary voltages issued by the local DC/DC converter and by 150% of the maximum primary current issued by the relevant protection (SSPC or fuses).

I/A

720 e) The ground strap shall be of rectangular cross section with a length to width ratio not greater than 5 and minimum

thickness 0.075 mm. The contact area at both ends of the strap shall be at least 1 cm². I

730 f) Electrical equipment shall have a bonding resistance equal to or less than defined in figure 2.2.2.2/1 for both test

polarities per bonding junction between:

• different parts of the equipment chassis,

• connector receptacles and equipment chassis/connector brackets,

• equipment chassis and bond strap,

• bond strap and structure.

T

2.3 HARNESS REQUIREMENTS

2.3.1 Categorization

735 The ATV vehicle wiring shall be divided into 6 categories. The categorization shall be made on the basis of the characteristics of the signals on the wire, and hence the interference generated, and on the susceptibility of the wire circuit to interference. Twisted cables are of general use except when coaxial cable are required.

The categories shall in principle contain the following types of signals:

R R

I/F TYPES EMC CAT. CABLE TYPES

CABLE SPECIFICATION FOR CONTROLLED

ENVIRONMENTS CABLE SPECIFICATION FOR

SPACE EXPOSED USE






EQ SS EL SYS

Main DC Power

Secondary Power

1 1

TP

TP

ESA/SCC 3901/017 for AWG 0, 4 and 8 ESA/SCC 3901/018 or /013 for AWG 12 and higher

ESA/SCC 3901/017 for AWG 0, 4 and 8 ESA/SCC 3901/018 for AWG 12 and higher

Motor Interfaces 1 TSP/TSQ

5 V Commands | 28 V Commands | > 1A 15 V Commands |

2 2 2

TP/TMC* TP/TMC* TP/TMC*

ESA/SCC 3901/18 ESA/SCC 3901/18

5 V Commands | 28 V Commands | < 1A

15 V Commands |

3 3 3

TP/TMC* TP/TMC* TP/TMC*

ESA/SCC 3901/18 or /013 ESA/SCC 3901/18

Valve Position Interfaces 4 TSP/TS3C

Analog Signals Bi-Levels Signals

4 4

TSP/TSQ TSP/TMC

ESA/SCC 3901/18 or /013 ESA/SCC 3901/18

Serial data lines (RS 422 A)

5 TSP (100 Ω) ESA/SCC 3902/002 ESA/SCC 3902/002

MIL-STD-1553 Bus Extension

5 TSP (75 Ω) ESA/SCC 3902/002 or SSQ 21655

ESA/SCC 3902/002 or SSQ 21655

APM IEEE 802.3 5 TSP (75 Ω) ESA/SCC 3902/002 ESA/SCC 3902/002

User Time Clock Lines 5 TSP (100 Ω) ESA/SCC 3902/002 ESA/SCC 3902/002

Modulation Signal lines Video Lines Audio Lines

4 5 4

TSP (75 Ω)

TSP (75 Ω)

TSP (75 Ω)

ESA/SCC 3902/002 SSQ 21654/002 SSQ 21654/002

ESA/SCC 3902/002 SSQ 21654/002 SSQ 21654/002

Explosive device Circuits 6 TSP ESA/SCC 3901/018 or 013 ESA SCC 3901/018

LEGEND: TP : Twisted Pair -TMC: Twisted Multi Cable - TSP: Twisted Shielded Pair - 3C: 3 cables - Q: Quarte * shielded TMC will be used when one return for many commands is used.

2.3.2 Routing & layout






EQ SS EL SYS

740 a) The bundles shall not contain wires from different categories. In particular for wires from category 6, and as in advance answer to a foreseeable request for waiver w.r.t. harness lay-out implementation, it could be allowed to route in a same bundle cat.1&2, or cat.3&4. These agreements are not automatically applicable to connector arrangement. .

R R

750 b) The bundles have to be routed as close as possible from metallic structure. I I

760 c) The redundant bundles shall be separated as far as possible from the nominal bundles. R R

770 d) Where cables of different categories must be routed along a common path, a cable layout management shall

arrange 5 cm distance between different categories except 10 cm for pyro lines. I I

780 e) Where categories must cross each other the crossing angle between the categories shall be approximately 90°. I I

2.3.3 Harness shielding

2.3.3.1 Shielding

790 a) Shield with at least 80% coverage shall be used. Harness shield shall be terminated so as to minimise the unshielded portion of the internal conductor. The unshielded part of any single cable shall not exceed 2.5 cm if not inside a closed backshell.

I I

800 b) All cable shields shall be grounded at both ends including intermediate connector brackets. R R

810 c) Shields shall not be used as an intentional current-carrying conductor, except for coaxial cables and RF circuits. R R






EQ SS EL SYS

820 d) The DC resistance between any harness shield and its ground reference shall be less than 5 mhom. That means the DC resistance between any harness shield termination and equipment structure shall be less than 10 mhom.

T T

830 e) Structure termination of shields shall be made via connector housing (HALORING Technology for example: figure

2.3.3.1/1). R/I R/I

840 f) However, for dedicated mission application. A provision for a 3 cm added connector length shall be considered for

equipment implementation. I I

850 g) Co-axial cables used to stabilise line parameters shall be connected directly to chassis ground at both ends

through their dedicated connector. I I

860 h) Twisted and twisted shielded wire used for signal/power interfaces shall have the signal/power line twisted with

corresponding return line. R R

870 i) Multi conductor twisted/multi conductor twisted shielded cables used for signal line interfaces: the signal lines shall

be twisted with a common return line with the condition that the signals have the same source location and the same location receiver.

R R






EQ SS EL SYS

2.3.3.2 Overall shielding

880 a) Bundles external to the module structure shall be overall shielded. R/I R/I

890 b) Overall shields shall be necessarily circumferentially bonded at the both sides. I I

900 c) The same DC resistance values as required for single shield bonding apply. T T

FIGURE 2.3.3.1/1 HALORING CONNECTION AND

SOLDERING






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2.3.4 Harness connectors

910 a) A harness categorization is defined § 2.3.1. This categorization shall also be maintained through harness connectors. This means that only one category can be routed through one connector, except those used in connection with Ground Support Equipment. This is also valid for intermediate connector brackets.

R R

920 b) When sharing of connectors cannot be avoided the categories shall be divided in the connector by a grounded

row of pins. This shall first be approved by the procuring authority but in any case, pyro-lines shall have a separate connector.

R R

930 c) Deleted I I

940 d) The twisted wires shall be routed through a connector on adjacent pins to minimise the wire loop. R R

950 e) 100% of return current excluding allowable common mode current shall flow through the dedicated pins since

return line is twisted with positive wire. Particular care shall be taken with redundancy which use separate bundles, and so isolation is needed between nominal and redundant returns.

R R

960 f) All demontability connectors shall be crimp type. I I

970 g) Backshell or other strain relief devices shall be used on plug connectors. I I

980 h) Connector backshells, strain relief, cable clamps and the screws shall be secured-by-self-locking or adhesive

applications. I I






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3. POWER QUALITY REQUIREMENTS

Architecture

The electrical power is conditioned and distributed to the main users via a regulated 28 V DC main bus (provided by PCDU equipment) except for some non-critical heater lines of the thermal control function, which are supplied with a non regulated voltage on a separate busbar (also provided by PCDU equipment).

Connection between battery/rechargeable battery and PCDU star point, as well as connection between 0 V PCDU start point and ATV vehicle structure, shall be realised through enough wires, in order to sustain battery fault current without fusing, and so, as close as possible to the capacitor bank.

Distribution and protection of primary power to every equipment or independently reconfigurable unit will be achieved through dedicated Solid State Power Controllers (SSPC) located on PCDU board associated to a dedicated power line pair.

A double insulation between the energy sources and the SSPC input located inside the PCDU shall be provided.

Each battery or rechargeable battery shall be equipped with fuses in order to avoid Thermal Battery Destruction (TBC).

The ATV vehicle main bus switching protection and distribution principle is given by the figure 3.1/1. It is based on the fact that power S/S provides a protected (current limited) main bus. The use of fuse is forbidden.

In case of redundant user, one protection is provided per redundant unit.






EQ SS EL SYS

S S P C 3

S S P C n

S S P C 1

S S P C 2

A u x i l i a r y S u p p l y

P C D UP C D U

B U S B A R

D i r e c t T M / T CI / F

R e m o t e T e r m i n a l

P o w e r c o n d i t i o n i n g a n d t r e a t m e n t

U s e r 1

U s e r 2

U s e r 3

U s e r n

REMARK -

PCDU's will be implemented with no cross-strapping between each PCDU. In general, the users will have the nominal unit powered from one PCDU and the redunded unit from the other one. In consequence no cross-strapping is allowed between the nominal and redundant channel of one equipment if this cross-strapping is not two failure tolerant.

These power quality requirements apply to each DC-voltage regulated bus.

Verification is performed at appropriate level on resistive loads.

FIGURE 3.1./1

ATV VEHICLE POWER DISTRIBUTION (SCHEMATIC)






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3.1 REGULATED POWER BUS CHARACTERISTICS (SYSTEM LEVEL)

This paragraph is applicable at system level and as a consequence to PCDU equipment as functional specifications.

The power S/S provides independent voltage regulated dc main buses, the regulation point of which shall be within the PCDU unit and that gives power quality features, which applies for the entire range of utilisation (temperature, load, radiation, initial calibration, etc.).

3.1.1 Power bus quality

3.1.1.1 Steady-state voltage range/bus voltage regulation( PCDU output)

1010 a) Whatever the power supply source is, the steady state voltage range (beyond 5 ms), measured at each dc outlet of each PCDU, is specified to be 27,5V ± 1 V under the condition of normal electric system operation.

(Master specification: measured at regulation point (main bus capacitor) level the steady state voltage range is 28V ± 1%.)

T

1020 b) On abnormal conditions over and undervoltage protection shall avoid output voltage to be, beyond 0.5 ms, out of

the range 24,5 - 32V. R

3.1.1.2 Bus stability

1030 a) The phase margin of the regulated bus shall be 60° or greater. The associated gain margin shall be 10 dB or more.

R/T

1040 b) The turn over frequency (capacitive to inductive) of the stability providing capacitor shall be beyond 80 kHz. T






EQ SS EL SYS

3.1.1.3 Bus impedance

1041 The impedance at the regulation point shall remain below the impedance mask shown in figure 3.1.1.3/1. A/T

0,001

0,01

0,1

1,E+00 1,E+01 1,E+02 1,E+03 1,E+04 1,E+05

F (Hz)

Zs O

hm (f

or U

²/P=1

Ohm

)

Z_source

3.1.1.4 Steady state bus ripple voltage

1042 The bus ripple voltage at the point of regulation shall be less than 0.5% p-p of the nominal voltage under nominal bus conditions.

T

FIGURE 3.1.1.3/1 OUTPUT IMPEDANCE

MASK






EQ SS EL SYS

1043 The bus load shall be resistive and the measurement shall be performed with an oscilloscope having a BW of at least 50 MHz.

T

3.1.1.5 Bus transient

1044 Bus transient due to interdomain operation shall not produce a transient voltage of more than ± 1% of the nominal bus voltage within a time constant less than 2 ms.

T

1045 Multiple domain excursion worse-case transient shall not exceed ± 4% within a time constant less than 2 ms.

T

3.1.1.6 Steady state bus commutation spike voltage

1046 The bus spike voltage at the point of regulation shall be less than 2% p-p of the nominal voltage.

T

1047 The bus load shall be resistive and the measurement shall be performed with an oscilloscope having a BW of at least 50 MHz.

T

3.1.2 Solid state power controllers

Two types of solid state power controllers are ATV usable.

• Latching SSPC: one pulse command sets ON state; another pulse sets OFF state. In case of conflict, OFF command shall have the highest priority.

• Permanent SSPC: the permanent SSPC is ON as soon as the primary voltage is present; in case of trip off, it






EQ SS EL SYS

senses periodically the fault condition and restores the ON condition autonomously after fault clearance. It shall be possible by command to inhibit this SSPC.

It shall be able to support a permanent fault load condition without stress (attention is to be paid to power cycling). It shall be possible to set at manufacturing level the operating current value to any discrete value.

Common performance requirements for SSPC:

1050 a) the standard SSPC and the latching SSPC shall autonomously initiate in OFF state at primary power initialisation or after a primary power reset,

R/T

1060 b) SSPC shall limit output current to a value < 1.3 operating current within 5 µs after any fault load conditions (at + 10% of static limit),

R/T

1070 c) SSPC shall switch off after 10 ms to 15 ms of current limitation duration compatible with thermal switch dissipation, R/T

1080 d) SSPC overall serial resistance shall ensured a voltage drop less or equal to 0,5 V, T

1090 e) SSPC shall withstand, or control, surge voltage induced by OFF switching of inductive load < 1 mH, R/T

1100 f) SSPC shall withstand capacitive load up to 120 µF, R/T






EQ SS EL SYS

1110 g) on control after trip off will be obtained through an OFF command followed by an ON command after a 10 ms minimum delay time,

T

1120 h) into OFF state and when considering end of life performance, the leakage current value, multiplied by the SSPC output resistance value, shall remain less than 1 V,

T

1130 i) the current slew rate shall be limited to 1 A/µs. R/T






EQ SS EL SYS

3.2 INDUCED REQUIREMENTS AT EQUIPMENT POWER I/F (UNIT LEVEL)

Power loads utilising the primary regulated 28 V shall be design to be compatible with the power source here above characterised but through the following requirements taking into account the whole assembly configuration on one hand, and including safety margin on the other hand.

3.2.1 Steady state voltage range

1140 a) All units shall have their nominal performances within the following steady state voltage range: 27 V ± 1,5 V. T

b) Deleted

1150 c) All units shall withstand without damage or stress a permanent primary power bus voltage inside the 0 V to 32 V domain.

T

1160 d) All units shall survive a permanent external short circuit at the input of any power bus voltage between 0 V and 32 V. T

1170 e) All units shall withstand power down and up regardless of the intended configuration of the unit. A/T

1180 f) All electronic logic units/circuits shall assume a defined and safe configuration upon application of nominal voltage range power supply

A/T

1190 g) In addition to requirement a), outside the nominal voltage range 25,5 - 28,5 V, and up to the range 24 - 32 V, all units shall remain in a safe configuration (i.e .no spurious action) .

A/T






EQ SS EL SYS

3.2.2 Power consumption requirements

1200 a) The power allocations for S/S/equipment are given in the corresponding S/S/equipment specifications, they shall cover all the operating modes and the mean and peak figures with a maximum duty cycle for the peaks.

R/A

1210 b) The compliance versus the power allocations shall be established by taking into account the worst case conditions

(qualification temperature range, disparity components, radiation, ageing, input voltage range). A

1220 c) Difference between power measurement on different models shall be less than 5%. R/T

3.2.3 Inrush current

The inrush laps of time is defined when the unit input voltage has reached a value of more than 25 V and the current no more limited to its maximum value. For the computation of the inrush current, early in the design phase, the self saturation effect shall be taken into account (if applicable).

1230 a) At switch-on and for any mode change, the in rush charge (current x time) to any unit shall be limited to 2.5 10-3(s) x Inom (A).

T

3.2.4 Relay sizing

The relays sizing shall be compliant with following rules in addition of derating rules given in [AD3]:

1240 a) maximum current on resistive load shall be less than 0.75 lmc (Imc is contact rating specified by manufacturer), R/A






EQ SS EL SYS

1250 b) maximum current on inductive load shall be less than 0.4 Imc.

In case of transient (in particular inrush current) following rule shall be applied

R/A

1260 c) if duration is greater than 10 µs, then (I2 tmax) shall be less than (160 I²mc/µs) where I is the current across relay, T

1270 d) if duration is less than 10 µs, Ipeak shall be less than 4 Imc. T

1280 e) Moreover, electrical circuit shall be such that relay failure causing intermediate position of moving part shall not create single point failure.

R

1290 f) It shall be demonstrated that relays used on equipment which are ON during the launch phase will not generate micro cut-off higher than those specified § 4.1.8 when qualification vibrations levels are applied.

R/T

3.2.5 Power I/F circuit design

Deleted (refer to [RD3])

3.2.6 EMC performance

Conducted emission and conducted susceptibility of equipment connected to ATV primary power lines are specified § 4.1.1.1. and § 4.1.4.1.






EQ SS EL SYS

These specifications do not apply to equipment connected to ISS-RS power line or other dedicated power sources (i.e. PCDU’s and RECS,RDS,RFS assembly). Conducted emission and conducted susceptibility at power input are specified § 4.2.2.1 and § 4.2.2.3 addressing EMC performance induced by System I/F requirements.

3.2.7 Source impedance

1300 At user I/F the source impedance is defined by the addition of star point source impedance, SSPC serial resistance and harness impedance. Two models are defined according to the nominal power range of equipment.

A/T A/T

This specification does not apply to equipment powered by ISS-RS power lines, the source impedance of which is modelized with a specific LISN defined §4.2.1.1.

0,1

1

10

100

1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08

F (Hz)

Z (o

hms)

P< 50 W

P> 50 W

2x1µH

lisn_atv gr2

FIGURE 3.2.7/1

POWER BUS SOURCE IMPEDANCE AT USER I/F






EQ SS EL SYS

4. EMC SPECIFICATIONS

4.1 EQUIPMENT/ASSEMBLY USING ATV PRIMARY REGULATED 28V. BUS

Emission measurement General

Both intentional and unintentional levels are contained in the emission requirements hereafter. Except when otherwise stated the levels are given in RMS values (whatever the detection mode is).

The levels are recorded when the power supply voltage of the unit under test is set to the voltage yielding the maximum emission levels.

The bandwidth of the EMI receiver shall be, dependent on the frequency range, as follows:

Frequency range Bandwidth 30 HZ - 1 KHZ 10 HZ

1 KHZ - 10 KHZ 100 HZ

10 KHZ - 150 KHZ 1 KHZ

150 KHZ - 30 MHZ 10 KHZ

30 MHZ - 1 GHZ 100 KHZ

1 GHZ - 40 GHZ 1 MHZ

If the bandwidths listed above are not available on instrument used for radiated emission measurement the bandwidth nearest to those identified shall be used and noted on the data sheet.






EQ SS EL SYS

4.1.1 Conducted emissions

4.1.1.1 Primary power lines

(Common mode + differential mode load current emission)

1310 In the frequency band 30 Hz to 50 MHz, the current emission on any primary power line or return shall not exceed the following limits. The limits apply to groups of wires (e.g. from a single connector) and not to individual wires.

Limits:

• narrow band current limits are defined in figure 4.1.1.1/1,

• time domain current ripple plus spikes shall not exceed 20 mA p-p, measured with a 50 MHz BW,

• the slope of any load current step change (e.g. during change of operational mode and at switch-off) shall not exceed a rate of 106 A/s.

The (CEP) limits defined above are applicable to all normal operating modes for the equipment under tests.

T






EQ SS EL SYS

30

40

50

60

70

80

90

100

1,E+00 1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08 1,E+09

F (Hz)

I (dB

µA)

34

80

Ce_eqpmt

4.1.1.2 Secondary power lines (at unit I/F level)

1320 When a secondary power is used externally to unit users, a 6 dB margin shall be verified at S/S level. Then conducted emission levels which are measured shall be the basis for susceptibility tests.

T

4.1.1.3 Signal lines

Due to the limited extent of such I/F (one emitter and one receiver), the EMI conducted emission specification are part of I/F requirements but always in accordance with EMC related requirements (i.e. tr, tf, common mode emission) when applicable.

FIGURE 4.1.1.1/1

NARROWBAND

CONDUCTED EMISSION LIMITS FOR PRIMARY

POWER USERS






EQ SS EL SYS

4.1.2 Radiated emissions

Radiated emission General

The upper frequency limit of E-field measurements shall be 1 GHz for equipment with operating frequencies below 10 MHz and shall be 10 GHz for equipment with operating frequencies between 10 MHz and 100 MHz. Equipment with operating frequencies above 100 MHz and receiver/transmitter S/S shall be tested up to 20 GHz but the test can be stopped at 10 GHz if no emissions are detected between 5 GHz and 10 GHz.

Distinction between Narrow Band (NB) and Broad Band (BB) shall be made as follows.

• In case of NB emissions:

the measurement level increases by less than 10 dB when the the receiver bandwidth is increased by a factor of 10.

• In case of BB emissions:

the measurement level increases by more than 10 dB when the receiver bandwidth is increased by a factor of 10.

4.1.2.1 NB Electric Fields

1330 Narrow band (NB) electric fields at 1 m distance from any piece of equipment (inside or outside) shall not exceed the limit of figure 4.1.2.1/1 measured in the frequency range 14 kHz - 20 GHz.

T






EQ SS EL SYS

0

10

20

30

40

50

60

70

80

90

100

1,E+04 1,E+05 1,E+06 1,E+07 1,E+08 1,E+09 1,E+10 1,E+11

F (Hz)

E-Fi

eld

(dB

µV/m

)

Re_eqpmt gr3

In addition to the limits of figure 4.1.2.1/1,

1340 lower limits shall be met, in the following specific receiver frequency ranges, according to the equipment location

T

FIGURE 4.1.2.1/1 EQUIPMENT NB E-FIELD

EMISSIONS






EQ SS EL SYS

FREQUENCY SYSTEM LEVEL (dBµV/m)

OUTSIDE EQUIPMENT

LEVEL (dBµV/m)

INSIDE Pressurized

Module EQUIPMENT

LEVEL (dBµV/m)

INSIDE Space craft

EQUIPMENT

Resolution Bandwidth

390 - 430 MHz 49 60 60 100kHz

420 - 480 MHz TCN A5 52 60 57 100 kHz

1 227.60 ± 20 MHz

1 575.42 ± 20 MHz

GPS 42

42

60

60

56

56

2 030.43 ± 20 MHz 2 106.40 ± 20 MHz

PLAST TDRSS

20 20

40 40

44 34

2202 - 2208 MHz

PLIST

34

54

58

3229 – 3245 MHz

(3240,3244.7MHz)

3294 – 3299 MHz

(3298.9,3294.2MHz)

KURS

(ATV rcvr)

(SM rcvr)

20

20

40

40

34

34

2 kHz

5450 - 5825 MHz

(5 650 MHz ± 5 MHz)

RR A5 65 65 65 10 MHz

The E-field measurements shall be performed in accordance with the test method RE102 of [AD2].

The measurements in the frequency ranges of the receivers may be performed with a bandwidth smaller than those specified above to obtain sufficient sensitivity when limited by measurement device noise figure.






EQ SS EL SYS

4.1.2.2 BB Electric Fields

Applicable to the receiver bandwidths.

1350 In case of BB emission, the nature of EMI emission shall be identified, measuring the bandwidth rate of change in dBµV/m per Hz.

T

4.1.3 Magnetic cleanliness

Deleted

4.1.4 Conducted susceptibility

Conducted Susceptibility General

Conducted specifications address to equipment when supply at nominal voltage (nominal value of steady state range).

4.1.4.1 Primary power lines port susceptibility

4.1.4.1.1 Sine wave injection

1360 Main bus powered units shall neither malfunction nor exhibit degraded performance or spurious response when a sine voltage with a frequency function amplitude indicated per figure 4.1.4.1.1/1, is injected into the primary power lines.

T






EQ SS EL SYS

Injection modes will be adapted from test methods CS01 & CS02 of [AD1]:

• differential mode set-up from 30 Hz to 1 MHz, using transformer or capacitor as coupling device according to frequency band,

• common mode set-up from 1 MHz to 50 MHz, using capacitive coupling

and in any case a sweep rate of 1 octave/minute with current limited to 2A.

0

1

2

3

1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08

F (Hz)

V (V

rms)

Cs_eqpmt

FIGURE 4.1.4.1.1/1

SINE WAVE SUSCEPTIBILITY LIMIT






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4.1.4.1.2 Transient injection

Differential mode

1370 Main bus powered units shall neither malfunction nor exhibit degraded performances or spurious response when voltage spikes/surges, with amplitude and duration not exceeding the limits of figure 4.1.4.1.2/2, are injected in differential mode on their supply lines.

T

-10

-5

0

5

10

1,00E-06 1,00E-05 1,00E-04 1,00E-03 1,00E-02 1,00E-01

Pulse Time duration (s)

Tran

sien

t Am

plitu

de (V

)

Cst_eqpmt_gr3

FIGURE 4.1.4.1.2/2

TRANSIENT SUSCEPTIBILITY

LIMIT






EQ SS EL SYS

Susceptibility test to power bus transients shall be performed as follows:

At least three tests (10µs, 0,5ms, 5ms for instance) shall be performed for each polarity, with a 1 Hz repetition rate and during an elapsed time ≥ 10 s.

Test methods must be adapted to the pulse duration (from CS06 of [AD1] for spikes, to source overlapping for surges), to get a transient between the profile defined by the figure 4.1.4.1.2/1 and an ideal rectangular shape.

-100

-75

-50

-25

0

25

50

75

100

Am

plitu

de (A

rbitr

ary

Uni

ts)

Time (linear scale)

Transient duration

Transient amplitude

FIGURE 4.1.4.1.2/1

TRANSIENT PROFILE






EQ SS EL SYS

Common mode

1380 Main bus powered units shall neither malfunction nor exhibit degraded performances or spurious response when a single positive or negative pulse is injected between each power line and ground from a source with the following characteristics:

• amplitude : Voc = 35 V (the amplitude is set under no load condition),

• duration : 100 ± 5 µs,

• rise time : ≤ 5 µs,

• Impedance : 500 Ω.

T

4.1.4.2 Secondary power line susceptibility (at unit I/F level)

1390 S/S contractor shall define requirements to secondary power users to verify a 6 dB margin between emission and susceptibility on secondary power lines.

T

4.1.4.3 Signal line susceptibility

Because of the various origins of expected EMI noise on signal lines, susceptibility envelope requirements are hereafter defined as a contribution to system robustness.

These specification are to be incorporated in specific I/F control document.






EQ SS EL SYS

4.1.4.3.1 ON/OFF Command line susceptibility

1400 Correct operation of ON/OFF command shall not be affected by transients having the following characteristics.

• Amplitude: nominal amplitude (either positive or negative, as relevant).

• Pulse width: 1 ms.

T

1410 For electrovalves command or other command different than relays commands the following susceptibility requirements are:

• amplitude : 2 x V nominal amplitude (either positive or negative, as relevant),

• pulse width : 0.2 ms,

• rise and fall time : 10 µs,

• repetition rate : 5 Hz.

T

4.1.4.3.2 Digital line susceptibility

1420 Noise immunity shall be designed into serial digital circuits. Furthermore all digital lines shall not respond when a repetitive pulse (positive and negative) is applied on the signal input.

The pulse shall have the following characteristics:

• Amplitude:

- 10% of the nominal signal amplitude if the rise and fall time of the nominal signal are greater than 10 µs,

- The nominal signal amplitude/t,( where t is the min. of signal rise or fall time measured in µs), when t is within 1 and 10 µs,

- The nominal signal amplitude, when the rise or fall time of the nominal signal is smaller than 1 µs.

• Duration :corresponding rise or fall time or 10% of pulse whatever is less.

• PRF : 1 x 1(command pulse duration).

• Rise and fall time :less than 5% of duration as defined above.

T






EQ SS EL SYS

4.1.4.3.3 Common mode susceptibility

Standard signal I/F(i.e. interfaces referenced to secondary voltage return.)

1430 No damage, stress, mode switching or spurious command emissions shall occur in equipment when injecting between any input signal return and the ground reference plane the following common mode voltage.

• DC: 5 V.

• Transient:

- pulse amplitude : ± 5 V peak,

- duration variable from 10 µs to 100 µs at 50% of the peak amplitude.

- Rise time and fall time variable from 100 ns to 1 µs.

T

I/F referenced to primary voltage return (single ended emitter is not allowed)

1435 No damage, stress, mode switching or spurious command emissions shall occur in equipment when injecting between any input signal return and the ground reference plane the following common mode voltage.

• DC: 32 V.

• Frequency domain:

- Sinus: from 10 kHz to 50 MHz - 1 V RMS with current limited to 2A.

• Transients:

- pulse amplitude : Voc= ± 35 V,

- duration : 100 ± 5 µs,

- rise time : ≤ 5 µs,

- source impedance : 500 Ω.

T






EQ SS EL SYS

4.1.5 Radiated susceptibility

4.1.5.1 NB Electric Fields

1440 The equipment/assembly shall not exhibit any malfunction, degradation of performance or deviation from specified parameters beyond tolerances given by the corresponding specification when irradiated, within 100kHz-20GHz frequency band, with fields defined as follows.

• 134 dBµV/m (5 V/m) for outside equipment

• 120 dBµV/m (1 V/m) for inside PM and inside S/C equipment

The electric field shall be modulated with 1 kHz 50% AM in the whole frequency band

T

At specific transmitter frequencies the irradiated field shall be increased and modulated as follows:


OUTSIDE EQUIPMENT

LEVEL (dBµV/m)

INSIDE Pressurized

Module EQUIPMENT

LEVEL (dBµV/m)

INSIDE Space craft

EQUIPMENT

Modulation

425 MHz Ground radar 155(60V/m) 134 140 Pulse 1000 burst/s – 10µs

burst length

924.6 MHz Regul OS 155 (60V/m) 134 134 Pulse

1 kHz-50% duty cycle






EQ SS EL SYS

1.1 – 1.5 GHz Launch pad env. 134 120 120 Pulse 1µs pulse width- 10-3 duty cycle

2030.4 MHz PLIST 146 120 120 Pulse


2,2 – 2,29 GHz

2206.5-2267.5MHz)

TM A5 134 120 120 Pulse


2,2 - 2,9 GHz

(2205-2287,5-2805-MHz)

S-Band

(PLAST,TDRSS,OML)

146 (20V/m) 126 (2V/m) 134 Pulse


2,9 – 3.4 GHz Launch pad env. 134 120 120 Pulse 1µs pulse width-

10-3 duty cycle

3.240 GHz

3.2447 GHz

KURS Π 155 120 120 Pulse


3.976 GHz

5.339 GHz

5.891 GHz

Ground radar 155(60V/m) 134 140 Pulse 1000 burst/s – 10µs

burst length

5,4– 5,9 GHz (5650MHz)

RR A5 134 120 134 Pulse 1µs pulse width- 10-3 duty cycle

8 to 10 GHz Ground Radar 146 126 134 Pulse 1µs pulse width- 10-3 duty cycle

8.5 GHz Ground Radar 158 (80V/m) 138 (8V/m) 143 (15V/m) Pulse 1µs pulse width- 10-3 duty cycle

13.7 to 15.2 GHz (15.155 -

15003,4GHz)

LIRA KSAR

165 (180V/m) 146 151 (35V/m) Pulse 1µs pulse width- 10-3 duty cycle






EQ SS EL SYS

The susceptibility to electric fields of equipment/assembly shall be in accordance with test method RS 03 of [AD1].

In any case, the field amplitude is defined with no modulation condition.

In addition, no damage shall occur at ATV receivers input when their antennas are irradiated with a field of 155 dBµV/m (60 V/m) at frequencies 1.5 GHz, 2.118 GHz & 2.762 GHz

4.1.6 Electrostatic discharge susceptibility

ESD due to human handling

Deleted (refer to [RD3])

ESD due to in-flight conditions

1450 No malfunction, degradation of performance or deviation from specified parameters beyond tolerances given by the corresponding specification shall occur when equipment and I/F lines are exposed to a repetitive electrostatic arc discharge from a 50pF capacitor charged up to 6 kV and discharged through a 100 Ω resistor between selected parts of equipment housing and ground plane. It is also acceptable to perform the test with a capacitor of 150 pF and a 330 Ω resistor.

The pulse repetition rate shall be 1 Hz. The test duration shall be 1 min.

T

The test set-up shall be in accordance with figure 5.5/7.which images the location of the spark device to take into account field illumination of equipment and harness, and location of the ground connection in order to be also representative of current coupling with harness.

The test shall also be performed with reversed polarity.






EQ SS EL SYS

4.1.7 Lightning stroke susceptibility

1460 Electronic equipment and the interfacing harness may be subjected to lightning-produced transient magnetic fields during control operations on launch pad. This field shall not cause damage or permanently degrade an I/F of the electronic units.

A/T A

For the analysis of effects at the interfaces, a maximum common mode transient voltage of 30 Vp (as Voc) with a minimum rise time of 4 µs and a maximum duration of 100 µs shall be assumed, delivered with a 10 Ω source impedance.

When the I/F circuit is grounded the transient applies in differential mode.

Analysis or test verification shall be performed on each input interfaced with launch pad GSE. If assessment is made by test this one shall be carried out in accordance with pin injection test of [AD4](refer to § 2.2.5.1 of [AD4]) on powered equipment.

Non degradation is verified after test completion, including the voltage clamping device integrity, if applicable.

4.1.8 Susceptibility to micro cut-off

1470 The equipment which is operational during launch phase, shall survive and maintain all necessary functions when submitted to the following micro cut-off on its power line specified by a source impedance variation Zs.

T

100µ St

ZsVs

V nomZopen 100 k

Z nom

≥ Ω






EQ SS EL SYS

4.1.9 Corona effect

1480 Equipment with voltages above 250 Vp and equipment with voltages above 100 Vp when permanently exposed to plasma environment shall be designed to avoid corona effects. Such an equipment shall undergo a thermal vacuum test with operational performance. The requirement is fulfilled if no corona effect is observed during this thermal vacuum test

T

4.2 EQUIPMENT/ASSEMBLY USING ISS-RS POWER I/F LINES

This paragraph is applicable to equipment supplied through ISS power lines (i.e. PCDU and ,RECS,RDS,RFS assembly) and is constituting, for a large part, the I/F master specification, to ISS-RS power supply input port.

4.2.1 Power input requirements

4.2.1.1 Steady- state voltage range

1481 a) When docked at ISS-RS module the input power supply steady state (beyond 30 ms) range is specified to be 28V, +1.5/-4V.

(Master specification: ISS-RS source voltage is 28,5V, +0,5/-2,5V at ATV I/F.)

T A

1482 b) The voltage drop in ATV harness (between ISS-RS I/F and PCDU input) shall be 2 V @ max current. This

requirement supersedes the general voltage drop specification (§ 2.2.2.2.of [RD3]) T/A

1483 c) The RS-SM power network being ungrounded, its potential reference can be anywhere in the SSV range. So

equipment or assembly shall not exhibit any malfunction, degradation in performance, or deviations from specified parameters beyond the tolerances indicated in the individual equipment or subsystem specification when the “+” power line is grounded.

T T A

4.2.1.2 Source impedance

For the same reason, differential and common mode impedance are specified separately as features of a same

LISN set-up (fig.5.1/2) , to be used for emission measurements.






EQ SS EL SYS

0,01

0,1

1

10

100

1000

1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08

F(Hz)

Z(O

hms)

2x8 µH

2x4,5 µH

1,E-01

1,E+00

1,E+01

1,E+02

1,E+03

1,E+04

1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08

Frequence (Hz)

Zmc

(ohm

s)

with C2(refer to fig.5,1/2)

FIGURE 4.2.1.4/1

RS-SM LISN Common mode

IMPEDANCE

FIGURE 4.2.1.1/2

RS-SM LISN Differential

IMPEDANCE






EQ SS EL SYS

4.2.1.3 Local stability

To ensure system stability and as a conservative requirement avoiding further gain and phase margins analysis it is specified the individual input impedance of each unit connected on RS-SM power lines shall be, between 10 Hz and 100kHz, higher than the following module impedance profile.

0,01

0,1

1

10

100

1,E+01 1,E+02 1,E+03 1,E+04 1,E+05

F(Hz)

Z (o

hms)

z_load mask

4.2.2 Conducted emission CONDUCTED EMISSION GENERAL

The emission limits are specified through RMS values whatever the detection mode is. The levels are recorded when the power supply voltage of the unit under test is set to the voltage yielding the maximum emission levels.

The measurement bandwidths are defined §4 1.

FIG 4.2.1.3/1

LOAD IMPEDANCE

MASK






EQ SS EL SYS

4.2.2.1 Narrow band LF conducted emissions (CW differential voltage - Peak detection mode)

1490 In the frequency band 30 Hz - 10 kHz the RMS value of differential voltage interference in 28 V supply lines must not exceed the values given in figure 4.2.1.1/1.

T T

90

100

110

120

0,01 0,1 1 10

F(kHz)

Uef

f(dB

µV)

1,7kHz

0,25kHz

ce_lf-gr2

Interference measurements shall be carried out using the RS-SM equivalent network (LISN) , the differential impedance of which is drawn figure 4.2.1.1/2.

FIGURE 4.2.1.1/1

LF CONDUCTED

EMISSIONS






EQ SS EL SYS

4.2.2.2 Narrow band RF conducted emissions

(CW differential voltage - Peak detection mode)

1500 In the frequency band 10 kHz - 100 MHz the effective value of voltage interference in 28 V supply lines must not exceed the values given in figure 4.2.1.2./1.

T T

Interference measurements shall be carried out on the differential impedance of the RS-SM equivalent network (LISN) shown figure 4.2.1.1/2.

0

20

40

60

80

100

120

0,01 0,1 1 10 100

F(MHz)

Uef

f(dB

µV)

ce2_rf

In addition a 100 dBµV limit is accepted at switching frequency of PCDU dc/dc-converter (i.e. ≈100 kHz).

FIGURE 4.2.1.2./1

RF CONDUCTED

EMISSION






EQ SS EL SYS

4.2.2.3 Broadband emissions

Differential voltage in time domain.

1510 In time domain, voltage interference shall not exceed 1.4 Vpp, when measured in 20 MHz BW T T

4.2.2.4 Common mode emissions Common mode voltage in time domain

1515 During normal operation, common mode voltage transient shall not exceed ± 5 V what ever the duration is. The measurements shall be performed on the common impedance of the RS-SM equivalent LISN and according both impedance configurations, featuring two specific power network load configurations These two load configurations are part of the proposed LISN set-up , figure 5.1/2, switching the C2, 4.7µF capacitance , leading to the common mode impedance of figure 4.2.1.4/1

T

4.2.2.5 In rush current

1520 The maximum inrush current at switch-on shall be less than 100A. T T

1530 The time duration measured at twice the nominal value shall be less than 20ms

T T


The same limits as to other ATV equipment apply. Refer to § 4.1.2.






EQ SS EL SYS

4.2.4 Conducted susceptibility

CONDUCTED SUSCEPTIBILITY GENERAL

Conducted specifications are defined for any supply voltage inside the steady state range but refer to § 5.2 for test conditions

1540 Equipment or assembly shall not exhibit any malfunction, degradation in performance, or deviations from specified parameters beyond the tolerances indicated in the individual equipment or subsystem specification when subjected to the interference described in this section and injected onto input (and output eventually) power leads.

T T

4.2.4.1 LF conducted susceptibility

(CW voltage differential injection – RMS measurement)

Voltage rms values of sine wave interference differentially injected in 28 V supply lines are given in figure 4.2.3.1/1.






EQ SS EL SYS

0,4

0,6

0,8

1

1,2

0,01 0,1 1 10F (kHz)

Uef

f (V

)

cs_lf

1,7 kHz

The requirement is also met if the generator, set to produce the above mentioned required voltage in a 0.5 Ω load, cannot produce the same voltage within the test set up of figure §5.5/1 and the EUT is operating as specified

4.2.4.2 RF conducted susceptibility

(CW voltage differential injection – RMS measurement)

Effective values of sine wave interference differentially injected in 28V supply lines are given in figure 4.2.3.2/1.

FIGURE 4.2.3.1/1 LF CONDUCTED SUSCEPTIBILITY






EQ SS EL SYS

60

70

80

90

100

110

120

130

0,01 0,1 1 10 100F (MHz)

Uef

f (dB

µV)

cs_rf

The requirement is also met if the generator, set to produce the above mentioned required voltage in a 50 Ω load, cannot produce the same voltage within the test set up of figure §5.5/2 and the EUT is operating as specified

4.2.4.3 Impulse conducted susceptibility

Equipment or assembly shall not exhibit any malfunction, degradation in performance, or deviation from specified parameters beyond the tolerances indicated in the individual equipment or subsystem specification when subjected to the transients described in this section and injected onto input (and output eventually) power leads.

Test shall be performed using the appropriate parallel or series injection test set-up (fig 5.5/3 or fig 5.5/4), not excluding dc sources overlapping for long voltage variations, .and according to the following procedure:

FIGURE 4.2.3.2/1 RF CONDUCTED SUSCEPTIBILITY






EQ SS EL SYS

positive transients injected with the max value of the steady state power supply range and negative transients with the min value

1550 Pulse differential injection

The pulses applied and measured at EUT input, between plus and minus, shall have the following features (it is acceptable to achieve these features only during a calibration phase of the generator on performed prior to the injection a 1 Ω resistor)

T T

Amplitude ± 15V ± 10V

Duration at 50% amplitud 10µs < ≤100µs 300µs < <500µs

Rise and fall time one of them shall last <5% of pulse duration

Rate 0.1Hz with a duration test of 1minute for each ca

1555

Pulse common mode injection

The pulses applied and measured at EUT input, between each power bus line and ground, shall have the following features (it is acceptable to achieve these features only during a calibration phase of the generator performed prior to the injection on a 500 Ω resistor):

T T

Amplitude ± 10V Duration at 50% amplitude 10µs< ≤100µs Rise and fall time one of them shall last <5% of pulse duration Rate 0.1Hz with a duration test of 1minute for each case






EQ SS EL SYS

1560 Voltage variations

Single surge and dip between plus and minus of power bus of ± 1.5 V amplitude with a 30 ms duration measured at half amplitude and leading edge not >0.1ms

T T

4.2.5 Radiated susceptibility

The same limits as to other ATV equipment apply. Refer to § 4.1.5.

4.2.6 Electrostatic discharge susceptibility

The same specification as to other ATV equipment apply. Refer to § 4.1.6

4.2.7 Lightning stroke susceptibility


4.2.8 Susceptibility to micro cut-off


4.2.9 Corona effect







EQ SS EL SYS

4.3 FLIGHT CONFIGURATION

In this chapter are defined the System level EMC specifications composed of :

• Intra-system safety margin specification applicable at sub-assembly and system level and,

• Inter-system specifications applicable at I/F with the associated Systems defined here after.

4.3.1 I/F definition RADIATED INTERFACES :

Three I/F plans are defined as follows (Fig. 4.3.1/1):

- a RS-SM interface situated 1m ahead mechanical junction plan with Service module

- a virtual interface with the other modules of ISS defined at 1m distance perpendicular to the outer shell of ATV, abreast of junction plan between ICC and S/C in any azimuth angle

-an A5 interface situated 0.5 m ahead mechanical junction plan with ARIANE 5

S M & IS S

A 5

IS S & G roundA TV

R E

R E

R E

R E

R S

R S

R S

R S

FIGURE 4.3.1/1






EQ SS EL SYS

CONDUCTED INTERFACES:

The conducted power I/F with ISS-RS is the power input port materialised by connectors X1,X2, where inter system EMC specifications apply and which are automatically applicable to all equipment connected to this power line inside a potential EMC subsystem

Nevertheless, considering that Russian equipment are not compliant with SSS 3300 design requirements, basically EMC driving, it is difficult to consider they are part of ATV equipment fully integrated in a same compatibility analysis.

The differences between grounding/isolation requirements of Russian equipment (SSP 50094) and SSS 3300 impose equipment power and signal lines to be DC isolated the only way to make different panels of EMC specifications more easily compatible.

So they can be considered as an associated assembly and can be made EM compatible with ATV through I/F specification

A new conducted I/F between RECS,RDS,RFS assembly and other ATV equipment is materialised by connection between RECS power bus and PCDU’s power lines and between PCU’s secondary power lines and RECS,RDS,RFS assembly.

RECSRDS-RFS

CSCE

ISS-SM

ATV

CE

CSCE

CS PCDU

PCU

Transfer functionsCE/CE ’-CS/CS ’

Add.CE-CS

DOCKED

CONFIGURATION






EQ SS EL SYS

4.3.2 Intra system compatibility Intra system compatibility is based upon intra subassembly compatibility assessment and I/F analysis

Whole ATV internal compatibility is made of the following assessments

• Intra FS system compatibility downstream PCDU

• Intra RECS,RDS,RFS assembly compatibility

• Analysis of I/F compatibility between RECS,RDS,RFS assembly and PCDU’s

• Analysis of PCU’s uncoupling function

Intra FS system compatibility downstream PCDU Equipment specifications §4.1 fully apply what ever the configuration is (free flight , docking or attached phase)

1570 A conducted and radiated interference safety margin of at least 6 dB (20 dB for pyrotechnic functions) shall be verified using the emission and susceptibility test results and also using, if needed, the results of critical point emission measurement performed at system level, with flight-representative equipment and harness, on the ETM of the integrated flight configuration. This margin shall be 20dB if only simulation results are used.

A A

§3.1 Power quality requirements are verified through intra-system EMC measurements.

Intra RECS,RDS,RFS assembly compatibility Under the responsibility of a single contractor, RECS,RDS,RFS assembly can be considered as a single piece of equipment but must be, in this case, EMC qualified with an actual or fully representative interconnecting harness; if not, intra-system compatibility must be demonstrated through separate unit qualification and complementary test or analysis at assembly level.

When docked, specifications of §4.2. apply at interface between SM and RECS,RDS,RFS assembly

During free flight and docking, the use of PCU’s as a dedicated secondary source in parallel with dedicated batteries does not require any conducted specification beyond functional specification of PCU’s output.






EQ SS EL SYS

1580 In both cases, a conducted and radiated interference safety margin of at least 6 dB (20 dB for pyrotechnic functions) shall be verified

A

Analysis of I/F between RECS,RDS,RFS assembly and PCDU’s Equipment specifications §4.2 apply at interface between SM (or RECS) and PCDU’s

The compatibility between RECS,RDS,RFS assembly on one hand and PCDU’s on the other hand is assessed through analysis of tests .results, including additional requirements in order to control the safety margins

1590 A conducted and radiated interference safety margin of at least 6 dB shall be verified A

Analysis of PCU’s uncoupling function

In free flight and docking configuration, the compatibility between RECS,RDS,RFS assembly and ATV primary power network is verified through PCU’s direct and inverse transfer functions analysis or CE CS measurements performed at system level.

1595 A conducted interference safety margin of at least 6 dB shall be verified A/T

4.3.3 Inter system compatibility

Inter-system compatibility is based on ATV compliance with EMC specifications imposed at the interface port or interface plan between associated systems

The docked configuration with ISS - RS is the one sizing configuration inducing the following conducted and radiated Specifications.

4.3.3.1 Conducted emissions

Except § 4.2.1.4 requirement, which was created to control intra system compatibility all the others specifications of § 4.2.1 apply at I/F with ISS-RS






EQ SS EL SYS

4.3.3.2 Radiated emissions

These specifications apply to ATV system radiated I/F defined § 4.3.1 and where the measurements are made

They do not apply to RFI produced by emissions of ATV transmitter output channel which are specified in their Technical Specification through coherent requirements at antenna port

As a piece of information the field amplitude of ATV intentional emissions are expected to be:

• 150 dBµV/m @ 2 287.5 MHz (TDRSS),

• 142 dBµV/m @ 2 205.0 MHz (PLAST),

• 122 dBµV/m @ 3294.2.& 3298.9 MHz (KURS M),

at a distance of 1 m from the antennae (ATV transmitter nominal power level without margin nor losses are the basis of this specification).

1600 • At RS-SM I/F, ATV radiated interference shall not exceed the limit of figure 4.3.3.2/1, and the values of table 4.3.3.2./2 addressing the frequency bands of RS-SM receivers interested in ATV operations. (column 3)

A/T






EQ SS EL SYS

0

10

20

30

40

50

60

70

80

90

100

1,E+04 1,E+05 1,E+06 1,E+07 1,E+08 1,E+09 1,E+10 1,E+11

F (Hz)

E-Fi

eld

(dB

µV/m

)

Re_eqpmt gr3


on RS-SM I/F

Docked Configuration

LEVEL (dBµV/m)

on « ISS » I/F


LEVEL (dBµV/m)

on A5 I/F

Launch Configuration

420 MHz - 480 MHz TCN A5 35 (RBW = 100 kHz)

2202 - 2208 MHz

PLIST

34

FIGURE 4.3.3.2/1

RADIATED EMISSIONS

AT SYSTEM LEVEL






EQ SS EL SYS

3294 – 3299 MHz

(3294.2,3298.9 MHz)

KURS Π 20 (RBW =2kHz)

5450 - 5825 MHz

(5650 MHz)

RR A5 70 (RBW = 10 MHz)

TABLE 4.3.3.2./2

RADIATED EMISSION LIMITS IN RECEIVER FREQUENCY BANDS

1620 A/T

1630 In addition RFI induced in ATV receivers bandwidth (1 575.42 ± 20 MHz) GPS

(2 030.43 ± 20 MHz) PLAST

(2 106.40 ± 20 MHz) TDRSS

(3240 ± 1kHz, 3244.7 ±1kHz MHz) KURS M

will be verified at theirs antenna ports through

- power measurements wrt. ATV spurious emissions and

- antenna coupling (transfer function) wrt. ATV transmitter antennas

T






EQ SS EL SYS

4.3.3.3 Conducted susceptibility

4.3.3.4 Radiated susceptibility

1640 No malfunction, degradation of performance or deviation from specified parameters beyond tolerances given by the corresponding specification shall occur when the ATV is irradiated with electric field of 134 dBµV/m (5V/m) in the frequency band 100kHz – 20GHz in addition to the following field levels and frequencies:

T T


on RS-SM I/F


LEVEL (dBµV/m)

on « ISS » I/F


LEVEL (dBµV/m)

on A5 I/F

Launch Configuration

425 MHz Ground radar 155 (60V/m)

924.6 MHz Regul OS 155 (60V/m)

1.1 – 1.5 GHz Launch pad env. 134 134

2,2 – 2,29 GHz

(2206,5-2267-5MHz)

TM A5 146 (20V/m)

2,2 - 2,9 GHz

(2205-2217.5-2287.5-2265 MHz)

(2030,4-2805-MHz)

S-Band

GSTDN,TDRSS,ACS

(PLIST, OML,)

148 (25V/m)

146






EQ SS EL SYS

2,9 – 3.4 GHz Launch pad env. 134 134

3.240 GHz

3.244.7. GHz

Kurs Π 155 (60V/m)

3.976GHz

5.339GHz

5.891GHz

Ground radar 155 155 (60V/m)

5,4– 5,9 GHz (5650MHz)

RR A5 146

8 to 10 GHz Ground Radar 146 146

8.5 GHz Ground Radar 158 (80V/m) 158

13.7 to 15.2 GHz

15.155 GHz 15003,4 GHz

LIRA KSAR

162 (125V/m)

165 (180V/m)

As a principle the specified field levels are measured on mechanical I/F plan or on outer shell according to the test configuration

It is stated that the verification test procedure will be limited to the most representative configuration taking account of a representative modulation, (refer § 4.1.5.1) the expected impinging field direction and, should such be the case, the supposed higher penetration zone

The nominal frequencies are specified to direct as a minimum the verification process extent .

4.4 EGSE

The following requirements shall be applicable to system EGSE when used with qualification/flight integrated model and particularly for EMC testing at system level (flight configuration).






EQ SS EL SYS

4.4.1 Design requirements

4.4.1.1 Grounding

The design of EGSE directly interfacing with spacecraft electrical systems shall be in accordance with the grounding philosophy in § 2.1.1. So :

1650 EGSE power simulators supplying primary power to ATV power busses shall be grounded at the corresponding ATV ground reference point.

R

4.4.1.2 Bonding

1655 All metallic parts of the EGSE shall be electrically bonded. In addition the metallic structure of the EGSE shall be bonded to the ground reference plane of the spacecraft or the model the EGSE is connected to with a maximum of 5mhom.

R/T

4.4.2 Power bus characteristics

1660 a) EGSE simulating the 28 V primary power sources shall be able to operate in the steady state ranges as defined in § 3.1.1 of this specification.

T

1670 b) The maximum short circuit current provided by the EGSE power sources shall not significantly exceed the values of

the flight power source they intent to simulate. A/R

1680 c) The power source impedance at low frequencies shall not exceed the values of figure 4.2.1.1/2 including the cable

length between the EGSE and ATV module. R/T

4.4.3 Conducted emissions






EQ SS EL SYS

4.4.3.1 Narrow band emissions 1690

Narrow band conducted emissions at EGSE power bus simulator output shall not exceed the limit of figure 4.3.3.1/1.

T

The measurement shall be performed in frequency domain at ATV power I/F, between plus and minus lines, with the minus polarity grounded at ground reference point, on a resistive load at rated current.

0

20

40

60

80

100

120

1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08

F (Hz)

V (d

BµV

)

Ce_egse

4.4.3.2 Voltage ripple

1700 Voltage ripple at EGSE power bus simulator output shall not exceed the limit of 100 mV RMS.

T

The measurements shall be performed in the same conditions as § 4.3.3.1, in time domain with a 50 MHz

measurement bandwidth voltage probe.

FIGURE 4.3.3.1/1

EGSE I/F NB CONDUCTED EMISSION






EQ SS EL SYS


1710 EM field radiated by EGSE used in the vicinity of ATV in operation or used within the shielded room during EMC measurements shall not exceed 54 dBµV/m in the frequency range 14 kHz - 1 GHz.

T

5. EMC GENERAL TEST SET UP 1800 The EMC test set up shall comply with the requirements of the complete § 5. R R R

5.1 TEST FACILITY REQUIREMENTS

Radiated susceptibility tests shall be performed such that regulations and laws at the test location are met.

Reflection effects shall be minimised by means of absorber materials.

All equipment used for emission and susceptibility tests shall be calibrated and wear a valid calibration certificate.

Passive equipment, such as antennae, current probes, etc. must have calibration curves from the manufacturer.

If a shielded room is used, the ground plane shall be bonded to the room with low inductive bonds separated by less than 0.5 m. This connection shall be verified by a resistance test. This connection of the ground plane is very important when the EGSE has to be located outside room because of emission or susceptibility exceeding.

In the cases where real electrical/electronic loads cannot be used, they shall be simulated by dummy loads with similar characteristics. It is forbidden to use the I/F wires for grounding if not done so in the actual installation.

DC power sources required for the tests shall be connected to equipment through a line impedance as shown in figure 3.2.7/1. The figure 5.1/1 shows the proposed LISN layout.

For conducted system test and for test of equipment directly supply by ISS-RS power I/F, the suitable DC - source impedance is defined in figure 4.2.2.1.1/2. The proposed LISN layout is given figure 5.1/2.






EQ SS EL SYS

The tests shall be performed in an ambient electromagnetic environment which is at least 20 dB below the performances level of section 4.1.2. Included in the ambient level are also emissions from tests equipment including unit testers (EGSE) with its harness.

The test harness must be similar to flight condition (at least for the types of cables) No additional shielding between unit cables and measurement antennas is allowed.

The test harness length shall be as a minimum 3 m of which 1 m shall be exposed 10 cm from the edge of the ground plane at a 5 cm height.

Breakout boxes (for conductive tests) which are used for the line measurements shall be carefully designed to fulfill the purpose of the test.

Grounding of interfaces shall be in accordance with flight installation.

Bonding of units, unit tester, etc., to the ground plane shall be verified by a bonding test. The unit bond shall be similar to that specified for the actual installation except for conducted common mode emission/susceptibility tests when a ground strap between the grounding lug and the ground plane shall be used.






EQ SS EL SYS

InputPower C1

L1 R1

R3

R4

L2 R2

TestSample

R1,R2 : 0.25 ohm (P< 50W)R1,R2: 0.075 ohm (P> 50W)R3, R4 : 50 ohms

L1 , L2 : 1 microhenryC1 : 10000 microfarad ( used only if the power source has no ouput capacitance )

FIGURE 5.1/1 EQUIPMENT TEST LISN SET-UP






EQ SS EL SYS

L1 R1

R1 : 0.015 ΩR2 :0.375 ΩR3 : 0.15 Ω ,R4 :2.5 ΩR5 : 160 KΩR6 : 50 Ω

C1 : 10000 µF ( used only if the power source has no ouput capacitance )C2 : 4.7 µFC3, C4 : 1.2 µF

R6

InputPower

C1 TestSample

C2

R5

R6

L1 R1C3

L3

L3L4

C4

R3 R4

L1 : 7.5 µHL2 : 6 µHL3 :1.25 µHL4 : 24 µH

R2

R2

L2

L2

L3

FIGURE 5.1/2

SYSTEM TEST LISN SET-UP

5.2 TEST GUIDELINES

a) Equipment under test

Except where otherwise stated, tests will be performed at nominal power supply only, under EMI maximising operating conditions for emission measurements and under exhaustive function representativity conditions for susceptibility tests.

b) Accessory equipment precaution






EQ SS EL SYS

Care shall be taken to ensure that all accessory equipment used, such as spectrum monitors, oscilloscopes, earphone and other equipment used in conjunction with EMI analysers do not affect measurement integrity.

c) Excess personnel and equipment

The shielded enclosure of EMC test area shall be kept free of unnecessary equipment, cable racks and desks. Only the equipment essential to the test being performed shall be present. Personnel not actively involved shall not be permitted in the enclosure or test area.

d) Use of measuring equipment

All equipment used shall be operated as described in the respective instruction manuals unless otherwise specified in the appropriate test procedure and approved by the prime contractor.

e) Grounding of measuring equipment

It is important that the grounding of equipment (EMI instrumentation) be accomplished in accordance with the following rules to avoid false data that may be introduced by ground loops. Shocks hazards will be minimised by adherence to these rules if care is taken to have the instruments bonded to ground plane at all times.

• The antennae shall be remote from the measuring instruments.

• The EMI measuring instruments shall be physically grounded with only one connection.

• The EMI measuring instruments shall be connected to the AC line voltage (AC power source) through an isolation transformer. It is imperative that the chassis power ground be broken at this point to prevent the circulation of RF ground currents in the EMI test equipment.

• When differential voltage measurements are specified, matching devices (e.g differential probe) must be used; matching devices schematics shall be presented in the appropriate measurement procedure.

f) Monitoring of EMI measuring instruments

The IF of RF output of the EMI measuring instruments shall have the capability of being monitored with a device that gives an amplitude versus frequency presentation on a cathode ray tube or on an X Y recorder. This monitor shall be used to obtain information on the characteristics of the signals being measured.






EQ SS EL SYS

g) Identification of spurious responses in measuring equipment

The measuring equipment shall be monitored first for spurious emissions. False data caused by such spurious emissions shall be identified on X Y recordings or photos from cathode ray tubes.

5.3 TEST EQUIPMENT REQUIREMENTS

5.3.1 Receiving equipment

Any commercially available receiving equipment such as spectrum analyser, EMI receivers may be used, provided the equipment has the necessary sensitivity and frequency range to perform the conducted and radiated tests specified in this procedure and having the following frequency and amplitude accuracy:

• frequency accuracy : ± 2%,

• amplitude accuracy : ± 2 dB.

EMI receivers are preferred. The use of spectrum analysers shall be approved by the prime contractor.

5.3.2 Signal sources

Any commercially available signal source, pulse generator, power amplifier, capable of supplying the necessary modulated and unmodulated power required to develop the susceptibility levels over the frequency range specified in this standard may be used provided the following requirements are met:

• frequency accuracy : ± 2%,

• harmonic content : minimum 30 dB below fundamental power.

5.3.3 Test antennae

For susceptibility measurements any antennae can be used: the field strength shall be monitored in the test region in the vicinity of the unit under test.






EQ SS EL SYS

Antennae calibration curves shall be available and calibration shall be performed as defined thereunder.

If for any reason the contractor uses a different calibration method as specified below, the method must be properly specified in the test plan, as well as in the test report.

5.3.3.1 Test set-up

The test equipment should be arranged as shown below.

The set up should be arranged in a screened room which is lined out with RF absorbing material in order to achieve free space condition.

5.3.3.2 Measurement

At each test frequency using the receiver as reference device, the following measurements shall be performed.

• Adjust the signal generator output in order to obtain a receiver indication, make sure that the receiver is tuned for maximum response of the signal.

• Perform fine adjustments of the antennae alignment in the vertical and horizontal axis of the two antennas and record the signal generator and receiver settings.

• Disconnect the receiver and signal generator cables from their antennas and connect the signal generator and receiver together using the same cables and isolation pads including an additional 50 Ω coupling adapter.

• Reduce the signal generator output to obtain the same reading on the receiver as obtained in step (2). Record the generator setting.

• Solve for gain utilising the gain equation specified below in which Vr and Vt are the signal generator readings recorded in step (4) and (2) respectively.

• Repeat the measurements at every 10 MHz from 20 Mhz to 200 MHz and every 100 MHz from 200 MHz






EQ SS EL SYS

to 1 GHz. Above 1 GHz measurements shall be repeated every 1 GHz. Below 10 MHz the measurements shall be repeated every 10 kHz as a minimum.

• Equation for computing antennae factor (AF). The antennae factor (AF) shall be calculated using the following equation:

AF = 20 log 9.76λ G

dB

with, G=4π R/λVt/Vr

λ=wave length = 3 x 108

f m

and, R=1 m (or 4 m for the cavity backed spiral antennae).

5.3.3.3 Radiated emission

The loop antennae together with the EMI receiving equipment shall be capable of measuring magnetic flux densities at least 20 dB below the applicable limits for this test.

5.3.3.4 Radiated susceptibility

The loop antennae together with the signal source shall be capable of supplying sufficient current to produce magnetic flux densities 10 dB - 20 dB greater than the applicable limit at the test frequencies.






EQ SS EL SYS

5.3.4 Miscellaneous test equipment

5.3.4.1 Current probes

Any current probes capable of measuring to the limits and frequency range specified in this standard may be used. The transfer impedance curve of the probes used shall be included in the control plan as well as in the test report.

5.3.4.2 Line Impedance Stabilisation Network (LISN)

For the LISN used to perform the measurements specified in this standard an insertion loss or impedance curve shall be included in the control plan and test report.

5.3.4.3 Resistance measurements

The resistance measurements shall be performed by applying voltages such that no breakdown may be generated.






EQ SS EL SYS

5.4 TEST SET UP FOR EMISSION MEASUREMENT

5.4.1 CEP (Conducted Emission Primary power lines)

The test set up shall be as shown in figure 5.4/1. Any switch for ON/OFF test shall be positioned between LISN and the unit under test. The transients are then measured on the power lines between the switch and the unit under test.

(

EXT. POWER

BOND

SWITCH

GROUND

2,5m

UNITUNDERTEST

EGSE

1m

BOND

5cm

SFG0025

BONDS TO SHIELDED ROOM

RETPOWER

EMI INSTR./OSCILLOSCOPE

10 µ FFEED THROUGH

CAPACITORDC POWER ONLY)

MAXIMUM READINGWITHIN 0,5m

FROM THEUNI T

TWISTED WIRES (FLIGHT CONFIGURATION)

FIGURE 5.4/1

CONDUCTED EMISSION TEST SET-UP (PRIMARY POWER)






EQ SS EL SYS

5.4.2 CECM (Conducted Emission) secondary power lines or signals

The test set up shall be as shown in figure 5.4/2

EMI RCVR./OSCILLOSCOPE

EXT. POWER

2,5m

EGSE

Sec.Power Sign.

BONDS TO SHIELDED

UNITUNDERTEST

BOND

SEPARATE TEST BUNDLEARE DEPENDING ON ACTUALCONFIG.

TOINSTR.

10 cm SEPARATION

5 cm5 cm

1m

LISN

BOND

FIGURE 5.4/2

CONDUCTED EMISSION COMMON MODE TEST SET UP (SECONDARY POWER OR SIGNAL LINES)






EQ SS EL SYS

5.4.3 RE E (Radiated Emission, E field)

The test set up shall be as shown in figure 5.4/3. The emission at the antennae at 1 m distance from the test object which gives the highest reading shall be the RE E level.

EXT. POWER

BO ND

5cm

2,5m

UNITUNDERTEST

POWER

EGSE

1m

BOND

5cm

B O NDS TO S HIE LDE D RO OM

1m

SI G N

EMI METER

SFG0028

LISN

FIGURE 5.4/3

RADIATED EMISSION, E FIELD TEST SET-UP






EQ SS EL SYS

5.5 TEST SET UP FOR SUSCEPTIBILITY TESTS

5.5.1 CSP conducted susceptibility, power lines

The test set ups are shown in figures 5.5/1 to 5.5/4. The pulse tests shall be performed by switching the power source of the specified quantity in the specified time. The injected current relevant to the susceptibility threshold or to the voltage limit shall be monitored and recorded. For transient, the user can select parallel or series injection.

OSCILLATOR POWERAMPLIFIER

OSCILLOSCOPE ONHIGH-IMPEDANCE

VOLTMETER

TESTSAMPLE

EMIMETER

Z O U T 0,5 Ω

OR AUDIO POWER OSCILLATOR FOR SIGNAL SOURCE

P S

PERFORMANCEMONITOR FORDEGRADATIONOR DEVIATION

SFG0030

10 µ F FEEDTHROUGHCAPACITOR OR

PREFERABLY LISN

POWERSOURCE

60 AMP ISOLATORTRANSFORMER

FIGURE 5.5/1

Diff.Mode CONDUCTED SUSCEPTIBILITY (30 HZ/100 kHZ)






EQ SS EL SYS

10 µf

TESTSAMPLE

EMIMETER

LISN OR 25 µ HCHOKE FOR USEBETWEEN 50KHz

AND 1 MHz

6 dB ATTENUATIONRF SIGNAL

GENERATORRF

AMPLIFIER

COUPLINGCAPACITORS

RFRECEIVER

SFG0031

DCPOWERSOUCE

NO GREATERTHAN 5cm

LEAD LENGTH

FEEDTHROUGHCAPACITORS

OR PREFERABLYLISN

FIGURE 5.5/2

Diff or Com. Mode CONDUCTED SUSCEPTIBILITY (100 kHZ/ 50 MHZ)






EQ SS EL SYS

PERFORMANCEMONITOR FORDEGRADATIONOF DEVIATION

10µ F FEEDTHROUGHCAPACITORS

OR PREFERABLY LISN

SPIKEGENERATOROSCILLOSCOPE

25µ HCHOKE

TESTSAMPLE

SFG0032

FIGURE 5.5/3

CONDUCTED SUSCEPTIBILITY (TRANSIENT PARALLEL INJECTION)






EQ SS EL SYS

10µF FEEDTHROUGHCAPACITORS

OR PREFERABLY LISN

SPIKEGENERATOR

OSCILLOSCOPE

TESTSAMPLE

ISOLATIONTRANSFORMER

IF NOT PARTOF SPIKE

GENERATOR

SFG0033

DC POWERSOURCE

TOPERFORMANCE

MONITORINGINSTR.

FIGURE 5.5/4

CONDUCTED SUSCEPTIBILITY (TRANSIENT SERIES INJECTION)






EQ SS EL SYS

5.5.2 Common mode susceptibility tests

Refer to figure 5.5/5.

EXT. POWER

BOND

SWITCH5cm

2,5m

UNITUNDERTEST

1m

5cm

3 cm SEPARATION

SFG0025

BONDS TO SHIELDED ROOM

MAXIMUM REALDINGWITHIN 0,5m

FROM THE UNIT

EMI INSTR./OSCILLOSCOPE

RETPOWER

EGSE

FIGURE 5.5/5

COMMON MODE SUSCEPTIBILITY TESTS






EQ SS EL SYS

5.5.3 RS E radiated susceptibility, E field

The test set up shall be as in figure 5.5/6. The distance between the radiating antennae and the UUT shall be not less than 1 m. In case, the specified field strength cannot be achieved a shorter distance is permitted as long as the test region against the field strength is measured and specified.

EXT. POWER

BOND

5cm

2,5m

UNITUNDERTESTPOWER

EGSE

1m

BOND

5cm

BONDS TO SHIELDE D ROOM

SIGN

IF PO SSIBLE LOCATETHE EGSE OUTSIDE

THE SHEILDED RO OM

SIGNAL GENE.

SFG0034

OPTIONAL

FIGURE 5.5/6

RADIATED SUSCEPTIBILITY, E FIELD TEST SET-UP






EQ SS EL SYS

5.5.4 ESD (electrostatic discharge tests)

The test set up is described in figure 5.5/7 for ESD tests.

Towards test Bench

Metallic ground plane

Current probe

Bonding as required

10cm

C

High voltage sourceC = 50pF R ≤ 100ΩR1,R2 = 10KΩ

R2

LISN

1cm

R1

RSparkGap

+ -

1m0.5m

*

FIGURE 5.5/7

ESD TEST SET-UP






EQ SS EL SYS

6. GENERIC EMC VERIFICATION APPROACH

Due to the bottom-up verification process and the connection between verification items, some coherence in the verification methods must be implemented.

Every SSS-3300 design or performance requirement must be verified according to the matrix applicability included in DOORS format.

Allowed verification methods are justified in the EMC control plan (refer to RD1, § 6.4) viz: • Tests (T),

• Inspections (I),

• Analysis and similarly of studies (A),

• Review of Design (R).

Due to the nature of EMC specification, the preferred method are tests and analysis.

The verifications required at SS level need to be performed on Sub-systems integrated in a sub-assembly under the responsibility of a CN1 and traced in the Verification Control Document of the sub -system

Documents

Astrium Space Transportation ATV O S O D Issue : Revision : Date …emits.sso.esa.int/emits-doc/ESTEC/AO6337_AD3_ATV_AS_SSS... · 2010-01-13 · Internal Ref. : T031 n° 123 975 Page