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Potential Applications of Microcontact Printing for MID----------------
S. GoutS. Gout(1), F. Bessueille(2), M. Moguedet(3), Y. Layouni(1), A. Errachid(2), D. Leonard(2), V. Semet(1), M. Cabrera(1)
Speaker : Dr. Stéphane GoutInstitut des Nanotechnologies de Lyon
(1) Institut des Nanotechnologies de Lyon, (2) Laboratoire des Sciences Analytiques, (3) Pôle Européen de Plasturgie
g y
Contacts : Dr. Michel CabreraInstitut des Nanotechnologies de Lyonmichel cabrera@univ lyon1 [email protected]
Dr. François BessueilleLaboratoire des Sciences [email protected]
9th International Congress Molded Interconnect Devices, Nuremberg – Fuerth Germany, September 29th – 30th, 2010
Outlook
1 Introduction to Microcontact Printing (µCP)1. Introduction to Microcontact Printing (µCP)2. INL instruments for µCP3 Overview of the different routes to MID3. Overview of the different routes to MID4. Different ways for MID5 C i f th diff t5. Comparison of the different ways6. Conclusion and perspectives
1. Introduction to µCP
μCP is a Soft Lithography technique based on the use of an elastomeric poly(dimethylsiloxane) (PDMS) stampelastomeric poly(dimethylsiloxane) (PDMS) stamp
Principle:Principle: A. Kumar, G.M. Whitesides,, Applied Physics Letters 1993.
1. Introduction to µCP
μCP is quite different from "familiar" printing processes:- After inking, stamp is dried before printing.- µCP allows localization of 2-3 nm thick Self Assembled Monolayers (SAMs) of thiols on metals (Au, Ag, Pd, Cu, Ni, Al...)
→ One of the most promising Nanotechnology process.
Alkanethiols inkAlkanethiols ink in alcoholicsolvent
Hexadecanethiol (HDT) n = 15 (most studied)Octadecanethiol (ODT) n = 17 (best compromise)Eicosanethiol (ECT) n = 19 (efficient but expensive)
1. Introduction to µCP
SAMs are good protecting mask during chemical etching of thin metal layers (Au, Ag, Cu,...) → 1st possibility for MID !
However:- Metal thichness < 1 µm → Electroless and electrodeposition steps are necessary for MID.- In the litterature: silicon or glass substrates → Polymer?
1. Introduction to µCP
µCP is a versatile tool for Surface Chemistry with a wide range of potential applications in Micro and Nanotechnology → MID is a new one !
2. INL instruments for µCP
Microcontact Printer: 1st specialized machine (entirely developed at the INL):- Automated movement of the stamp- Low cost machine- High resolution patterning (400 nm) - Patented monitoring of the load on the stamp- Patented monitoring of the load on the stamp
Au lines on polycarbonate after wet etching 750 nm period and 400 nm width (INL/LSA/LTM)
E. Bou Chakra et al., Rev. of Scient. Inst. 79 (2008) 064102-064109.
2. INL instruments for µCP
Nanocontact Printer in dev.
Vertical movement
Printing area : Ø100 mm
Transparent PDMS stamp
Top and down alignment with CCD camera
XYθ stamp-substrate alignment
Stamp-substrate parallelism:3 piezoelectric actuators (10 nm)3 piezoelectric actuators (10 nm) Low cost 6 DOF printing head
High resolution load monitoring (µN):3 i l t i t t (10 )3 piezoelectric actuators (10 nm)
Inking : contact or pulverization
2. INL instruments for µCP
Nanocontact Printer in dev.
Fully automated compact machine
L d f N t N ( t t)Load can vary from N to µN (patent)
Printing:- in internal cavites of 3D structures
3D t t ith t l li f- on 3D structures with external relief- of isolated features (e.g. individual conductive lines for MID)- with stamps with 3D geometry: multilayer stamps (patent)
Printing on large surface (collective fabrication)Printing on large surface (collective fabrication)
High resolution at low cost (50-250 nm?)
F t hi h t h t i t tFast high troughput instrument
2. INL instruments for µCP
Printing inside 3D structuresPrinting on 3D structureswith external relief (eg microcantilevers)
The instruments allow new possibilities for µCP
Printing inside 3D structures with external relief (eg microcantilevers)
h = 25 µm
Printing of single features (ex : conductive line or pad)
h = 25 µms = 30 µmd = 18 µm
E. Bou Chakra et al., Sensors and Actuators B 2009
3. Overview of the different routes to MID
1st way: localized passivation of metal and etching starting with polymer/metal part
2nd way: localized passivation of catalytic species
3rd way: localized transfer of catalytic species and metallization starting directly with polymer part2 way: localized passivation of catalytic species
and metallization starting directly with polymer part
4. Way 1 to MID: localized passivation of metal
Principle: After electroless metallization, ODT is patterned by µCP to locally passivate the metal. Wet etching allows dissolution of the non protected areas.
4. Way 1 to MID: localized passivation of metal
Examples after ELD step: Cu Ag
Ø 10 C i PC Ø 5 µm Ag plots on PETØ 10 µm Cu pits on PC Ø 5 µm Ag plots on PET
100 µm Au interdigitated electrodes on PC as well as on LCP, PET, PI, COC, PBT...
4. Way 2 to MID: localized passivation of catalytic species
Principle: After surface activation with Pd(0), ODT is patterned by µCP to locally passivate the substrate
Electroless metallization is performed on the non-passivated areas.
4. Way 2 to MID: localized passivation of catalytic species
Examples with a stamp made of a "good quality" silicon master (after ELD step)
Cu
Cu lines on PC Cu lines on polyimide Kapton® HN100 µm
Example with a stamp made from a "low quality" master (RP technique): defects are printed!p
Cu
300 µm Cu lines on PC
4. Way 3 to MID: localized transfer of catalytic species
Principle: Based on the affinity of amine for palladium.Pd species are patterned after 1st plasma treatmentA 2nd plasma treatment allows Pd species reduction.Electroless metallization is triggered on the Pd(0) areas.
4. Way 3 to MID: localized transfer of catalytic species
Examples with a stamp made from a "good quality" silicon master (after ELD step)p p g q y ( p)
100 µm Cu electrodes on PC
Shape
Cu
100 µm Cu electrodes on PC100 µm Ni electrodes on PC
4. Way 3 to MID: localized transfer of catalytic species
Example with a stamp made from a "low quality" master (rapid prototyping technique): defects are printed !technique): defects are printed !
300 µm Cu network on PC at the scale of a CMS
Solution : Micro EDM millingg- Machine in dev. for master machining from CAD data (see Proceedings 4M 2010 and ESAFORM 2010).
- EDM is expected to be a good compromise: easiness, cost, resolution, surface quality, 3D machining for 3D masters and stamps !
5. Comparison of the different ways
Way 1 Way 2 Way 3
Ad t •Available on •Available on •Available onAdvantages •Available on standard polymers•Available with all metallization
•Available on standard polymers•No wet etching step
•Available on standard polymers•No wet etching step•No waste of catalytic
techniques•Submicrometric resolution•'Direct master' :
No waste of catalytic species or metal•Simplicity: 5 steps process
• Direct master : direct machining of the electrical interconnection in the master
•'Direct master' : direct machining of the electrical interconnection in the
master master
Di d t P iti t W t f t l ti Still 2 l tDisadvantages •Process sensitive to metal oxidation (Cu)•Waste of metal on non patterned areas
•Waste of catalytic species on non patterned areas•Inverse master
•Still 2 plasma steps
•9 steps process •6 steps process
6. Conclusion and perspectives
Comments on economical issues:
Low cost micro EDM process for the machining of master is in dev (=tooling)
fPlasma treatments are key parameters to control surface chemistry →development of specialized equipment
Microcontact Printing:
- Casting of stamp is a low cost techniqueg p q- A stamp can be replicated and used many times for printing- Reduced consumption of nano-ink (µl pulverization)- High throughput process (fast)- Collective fabrication process (printing on large surface = many parts)
6. Conclusion and perspectives
µCP is a versatile processµ p
- allowing printing of superimposable or side-by-side patterns with diff t t d i kdifferents stamps and inks:
→ stamps for standard electronic functions can be sequentially printed (modular electronics)sequentially printed (modular electronics)
- not limited to electrical interconnections: → integration of DNA chips, biosensors, bioMEMS, microfluidics→ electrochemical sensors→ optical gratings, etc.
6. Conclusion and perspectives
Achievements:
Compatibility of the process with un-modified standard polymers have been demonstrated.
Compatibility of the process with standard metallization techniques (ELD, electrodeposition) has been demonstrated.
Direct delimitation of interconnections followed by metallization has beenDirect delimitation of interconnections followed by metallization has been demonstrated
Anchoring of metallic layer on polymer is good (data not shown).
Electrical conductivity of metal is sufficient after electrodeposition (data not shown).
6. MID and µCP: conclusion and perspectives
Perspectives:Perspectives:
• Micro EDM machiningMicro EDM machining
• Optimized plasma machine
• Demonstration of MID 3D parts
• Development of 'demonstrators' for industrial applications
→ French collaborative project Plastronics on MID just granted this summer.Project coord: company A. Raymond from Grenoble.
Thanks for your attentionQuestions ?
Surface Chemistry: S. Gout (INL) and F. Bessueille (LSA)Instrumentation: V Semet (INL)
The project team
Instrumentation: V. Semet (INL)Electronics and application: Y. Layouni (INL)Process and injection molding: M. Moguedet (PEP)P j t M t M C b (INL)
Special thanks toProject Management: M. Cabrera (INL)
Instrumentation: E Bou Chakra (INL)Instrumentation: E. Bou Chakra (INL)High resolution µCP: P. Kleimann (INL)M. Boubtane (A. Raymond)Y Tocq et (LST)
This work was financed by grants L355 and L583 of Lyon Science Transfert (with support from the PRES of Lyon, the ANR, the FEDER, Y. Tocquet (LST) o e S o yo , e , e ,the Région Rhône Alpes and the Grand Lyon).
9th International Congress Molded Interconnect Devices, Nuremberg – Fuerth Germany, September 29th – 30th, 2010
