Tes Tem824la(Service)

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2005 Panasonic Communications Co., Ltd. Allrights reserved. Unauthorized copying anddistribution is a violation of law.

KX-TES824LAKX-TEM824LAKX-TE82461X

KX-TE82474X

KX-TE82480XKX-TE82483X

KX-TE82491X

KX-TE82492X

KX-TE82493X

KX-A227X(for Latin America)

Advanced Hybrid System

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.

Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.

When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and howit might be permissible to use Pb solder during service and repair work.

ORDER NO. KMS0502047C3


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1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 5

1.1. SUGGESTED PbF SOLDER 5

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS

USED 6

2 FOR SERVICE TECHNICIANS 7

3 CAUTION 8

3.1. SAFETY PRECAUTIONS 8

3.2. INSULATION RESISTANCE TEST 8

3.3. BATTERY CAUTION 8

3.4. CAUTION 8

4 SPECIFICATIONS 9

4.1. GENERAL DESCRIPTION 9

4.2. CHARACTERISTICS 9

4.3. SYSTEM CAPACITY 9

5 SYSTEM OVERVIEW 10

5.1. SYSTEM COMPONENTS 10

5.2. SYSTEM CONNECTION DIAGRAM 11

6 NAMES AND LOCATIONS 12

7 CONNECTION 12

7.1. SERIAL INTERFACE CONNECTION 12

8 DISASSEMBLY INSTRUCTIONS 13

8.1. DISASSEMBLY INSTRUCTION 13

9 BLOCK DIAGRAM 16

9.1. SYSTEM BLOCK DIAGRAM 16

9.2. POWER BLOCK DIAGRAM 17

9.3. KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM 17

9.4. KX-TEM824LA 2AP BLOCK DIAGRAM 18

9.5. KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT

BLOCK DIAGRAM 18

10 EXPLANATION OF BLOCK DIAGRAM 19

10.1. MAIN UNIT (KX-TES824LA/KX-TEM824LA) 19

11 CIRCUIT OPERATION 21

11.1. POWER SUPPY CIRCUIT 21

11.2. CO INTERFACE CIRCUIT 23

11.3. CROSS POINT SWITCH CIRCUIT 27

11.4. INTERCOM CIRCUIT 29

11.5. POWER FAILURE THROUGH CALL SWITCHING

CIRCUIT 30

11.6. DATA COMMUNICATION CIRCUIT 31

11.7. CONTROL CIRCUIT 33

11.8. TONE GENERATOR CIRCUIT 34

11.9. DTMF GENERATOR CIRCUIT 35

11.10. DTMF RECEIVER CIRCUIT 36

11.11. INT CALLID INTERFACE CIRCUIT 37

11.12. MODEM INTERFACE CIRCUIT 37

11.13. USB INTERFACE CIRCUIT 38

11.14. OGM INTERFACE CIRCUIT 38

11.15. RINGING SIGNAL GENERATOR CIRCUIT 39

11.16. SMDR INTERFACE CIRCUIT 39

11.17. DOORPHONE CARD INTERFACE (KX-TE82461X) 40

11.18. OGM CARD INTERFACE (KX-TE82491X) 40

11.19. BUILT in VOICE MESSAGE CARD INTERFACE (KX-

TE82492X) 41

11.20. CALL ID CARD INTERFACE (KX-TE82493X) 41

12 TROUBLESHOOTING GUIDE 42

12.1. NO OPERATION (Check POWER SUPPLY BOARD,MAIN BOARD) 42

12.2. NO DIAL TONE (KX-TES824LA, MAIN BOARD OF KX-

TEM824LA) 43

12.3. CANNOT DIAL (KX-TES824LA, MAIN BOARD OF KX-

TEM824LA) 44

12.4. CANNOT CALL EXTENSION (KX-TES824LA, MAIN

BOARD OF KX-TEM824LA) 45

12.5. CANNOT USE PROPRIETARY TELEPHONE (KX-

TES824LA, MAIN BOARD OF KX-TEM824LA) 45

12.6. CANNOT RECEIVE INCOMING CALL (KX-TES824LA,

MAIN BOARD OF KX-TEM824LA) 45

12.7. CANNOT SEND DTMF DIALING (KX-TES824LA, MAIN


12.8. CANNOT RECEIVE CALL DIAL TONE (KX-TES824LA,


12.9. CANNOT SEND A HOLD ON MUSIC (KX-TES824LA,


12.10. NO DIAL TONE (SUB BOARD OF KX-TEM824LA) 47

12.11. CANNOT DIAL (SUB BOARD OF KX-TEM824LA) 48

12.12. CANNOT CALL EXTENSION (SUB BOARD OF KX-

TEM824LA) 48

12.13. CANNOT USE PROPRIETARY TELEPHONE (SUB


12.14. CANNOT RECEIVE INCOMING CALL (SUB BOARD OF

KX-TEM824LA) 49

12.15. CANNOT SEND DTMF DIALING (SUB BOARD OF KX-

TEM824LA) 49

12.16. CANNOT RECEIVE CALL DIAL TONE (SUB BOARD OF

KX-TEM824LA) 50

12.17. CANNOT SEND A HOLD ON MUSIC (SUB BOARD OF

KX-TEM824LA) 50

13 IC DATA 51

13.1. IC700 51

13.2. IC6 53

14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES 55

15 HOW TO REPLACE A FLAT PACKAGE IC 56

15.1. PREPARATION 56

15.2. REMOVAL PROCEDURE 56

15.3. INSTALLATION PROCEDURE 56

15.4. REMOVING SOLDER FROM BETWEEN PINS 56

16 FIXTURES AND TOOLS 57

17 CABINET AND ELECTRICAL PARTS LOCATION 58

18 ACCESSORIES AND PACKING MATERIALS 59

19 REPLACEMENT PARTS LIST (KX-TES824LA/KX-TEM824LA)60

19.1. CABINET AND ELECTRICAL PARTS 60

19.2. ACCESSORIES AND PACKING MATERIALS 60

CONTENTS Page Page

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X-TES824LA / KX-TEM824LA /


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19.3. MAIN BOARD PARTS 60

19.4. POWER SUPPLY BOARD PARTS 70

19.5. SUB BOARD PARTS 71

19.6. FIXTURES AND TOOLS 77

20 FOR THE SCHEMATIC DIAGRAM 78

21 SCHEMATIC DIAGRAM (KX-TES824LA/KX-TEM824LA) 80

21.1. MAIN No.1 (Extention A-D Block) 80

21.2. MAIN No.2 (Extention E-H Block) 84 21.3. MAIN No.3 (CO Block) 88

21.4. MAIN No.4 (Cross-Point Block) 92

21.5. MAIN No.5 (ASIC, Memory Block) 96

21.6. SUB 100

21.7. POWER SUPPLY 110

22 PRINTED CIRCUIT BOARD (KX-TES824LA/KX-TEM824LA) 114

22.1. MAIN BOARD 114

22.2. SUB BOARD 116

22.3. POWER SUPPLY 118

23 KX-TE82461X (4-PORT DOORPHONE CARD) 119

23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER ISUSED 120

23.2. LOCATION OF OPTIONAL CARDS 121

23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM

122

23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT

OPERATIONS 124

23.5. TROUBLESHOOTING GUIDE 125

23.6. IC DATA 126

23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND

DIODES 127


23.9. REPLACEMENT PARTS LIST (KX-TE82461X) 129

23.10. FOR THE SCHEMATIC DIAGRAM 131

23.11. SCHEMATIC DIAGRAM (KX-TE82461X) 132

23.12. PRINTED CIRCUIT BOARD (KX-TE82461X) 134

24 KX-TE82474X (8-PORT SLT EXTENSION CARD) 135


USED 136


24.3. BLOCK DIAGRAM 140

24.4. EXPLANATION OF BLOCK DIAGRAM 140


24.6. IC DATA 149


DIODES 150





24.12. MEMO 157



25 KX-TE82480X (2-PORT ANALOGUE CO LINE AND 8-PORT

SLT EXTENSION CARD) 166


USED 167




25.5. CIRCUIT OPERATION 173


25.7. IC DATA 186 25.8. TERMINAL GUIDE OF ICS, TRANSISTORS AND

DIODES 187







26 KX-TE82483X (3-PORT ANALOGUE CO LINE AND 8-PORT

HYBRID EXTENSION) 206

26.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER ISUSED 207




26.5. CIRCUIT OPERATION 211


26.7. IC DATA 225


DIODES 227

26.9. CABINET AND ELECTRICAL PATRS 228






27 KX-TE82491X (MESSAGE EXTENSION CARD FOR DISA/UCD

OGMs) 248


USED 249





DIODES 253






28 KX-TE82492X (2-CHANNEL VOICE MESSAGE CARD) 259


USED 260



28.4. CIRCUIT OPERATIONS 263

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28.6. IC DATA 266


DIODES 267




28.11. SCHEMATIC DIAGRAM (KX-TE82492X) 27028.12. PRINTED CIRCUIT BOARD (KX-TE82492X) 272

29 KX-TE82493X (3-PORT CALLER ID CARD) 273


USED 274



29.4. CIRCUIT OPERATIONS 276


29.6. IC DATA 278


DIODES 280



29.10. FOR THE SCHEMATIC DIAGRAM 28329.11. SCHEMATIC DIAGRAM (KX-TE82493X) 284


30 KX-A227X (BACK-UP BATTERY CABLE) 287


30.2. REPLACEMENT PARTS LIST (KX-A227X) 289

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1 ABOUT LEAD FREE SOLDER (PbF: Pb free)Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatcontains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),

Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairwork we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

PbF solder has a melting point that is 50 ~ 70 F, (30 ~ 40C) higher than Pb solder. Please use a soldering iron withtemperature control and adjust it to 700 20 F, (370 10C). In case of using high temperature soldering iron, pleasebe careful not to heat too long.

PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100F, (600C).

If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

and be sure that any remaining is melted prior to applying the Pb solder. When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

1.1. SUGGESTED PbF SOLDER

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,

(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check themanufacturers specific instructions for the melting points of their products and any precautions for using their product with other

materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

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1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

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2 FOR SERVICE TECHNICIANSICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not touch IC or LSI pins with bare fingers.

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3 CAUTION

3.1. SAFETY PRECAUTIONS

1. Before servicing, unplug the power cord to prevent an electric shock.

2. When replacing parts, use only the manufacturers recommended components for safety.

3. Check the condition of the power cord. Replace if wear or damage is evident.

4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc. 5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent

the customer from being exposed to shock hazards.

3.2. INSULATION RESISTANCE TEST

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.

2. Turn on the power switch.

3. Measure the resistance value with ohmmeter between the jumpers AC plug and each exposed metal cabinet part, such asscrew threads, control shafts, handle brackets, etc.

Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired andrechecked before it is returned to the customer.

3.3. BATTERY CAUTION

1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by themanufacturer. Dispose of used batteries according to the manufacturers Instructions.

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact locationwhen replacing it and soldering the replacement lithium battery in.

3.4. CAUTION

The power socket wall outlet should be located near this equipment and be easily accessible.

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4 SPECIFICATIONS

4.1. GENERAL DESCRIPTION

Control Bus Original bus (16-bit, 24 MHz)

Switching Space Division CMOS Crosspoint Switch

Power Input 100 V AC to 240 V AC, 1.5A to 0.75A, 50 Hz/60Hz

External Battery +24 V DC (+12 V DC x 2)

Maximum Power Failure Tolerance 300 ms (without using backup batteries)Memory Backup Duration 7 years

Dialling Outside (CO) Line Pulse (10 pps, 20 pps) or Tone (DTMF)

Extension Pulse (10 pps, 20 pps) or Tone (DTMF)

Intercom Path 4

Mode Conversion Pulse-DTMF

Ring Frequency 20 Hz/25 Hz (selectable)Operating Environment Temperature 0 C to 40 C

Humidity 10 % to 90 % (non-condensing)

Conference Call Outside (CO) Line 2

Music on Hold (MOH) 1 portSelectable MOH: Internal/External/Tone

Paging Internal 1

Extension 1 port

Serial Interface Port RS-232C 1USB 1.1 1

Extension Connection Cable SLT 1 pair wire (T, R)PT 2-pair wire (T, R, H, L)

DSS Console 1-pair wire (H, L)

Dimension 368 mm (W) x 284 mm (H) x 102 mm (D)

Weight (when fully expanded) Approx. 3.5 kg

4.2. CHARACTERISTICS

Terminal Equipment Loop Limit PT 40

SLT 600 including set

Doorphone 20

Minimum Leakage Resistance 15000 minimum

Maximum Number of ExtensionInstruments per Line

1 PT or SLT in standard connection1 PT and 1 SLT in parallel connection

Ring Voltage 75 Vrms at 20 Hz/25 Hz depending on the ringing load

Outside (CO) Line Loop Limit 1600 maximum

Hookswitch Flash/Recall Timing Range 24 ms-2032 ms

Door Opener Current Limit 30 V DC/125 V AC, 3 A maximumPaging Terminal Impedance 600

MOH Terminal Impedance 10000

4.3. SYSTEM CAPACITY

4.3.1. System Capacity

KX-TES824 KX-TEM824

Basic System Outside (CO) lines 3 6Extensions 8 16

Fully Expanded System Outside (CO) lines 8 8

Extensions 24 24

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4.3.2. Maximum Cards Terminal Equipment

ltem KX-TES824 KX-TEM824

Extension Terminal 48 48

3-Port Analogue CO Line and 8-Port Hybrid Extension Card 1 -2-Port Analogue CO Line and 8-Port Single Line Telephone Extension Card 1 1

8-Port Single Line Telephone Extension Card 1 1

Message Expansion Card for DISA/UCD OGMs 1 1

4-Port Doorphone Card 1 1

3-Port Caller ID Card 3 32-Channel Voice Message Card 1 1

Doorphone 4 4

Door Opener 4 4

Pager 1 1

Music on Hold (MOH) 1 1

DSS Console 2 2

4.3.3. System Data

ltem Max. Quantity

Operator 1

System Speed Dialling 100

One-touch Dialling 24 per extension (PT)Personal Speed Dialling 10 per extension

Call Park Area 10Absent Message 6

Toll Restriction (TRS) COS 5

Extension Group 8

Message Waiting 8 per extension

Message for Buil t-in Voice Message 128 messages (total 60 minutes)

5 SYSTEM OVERVIEW

5.1. SYSTEM COMPONENTS

Model DescriptionMain Unit KX-TES824LA

KX-TEM824LAAdvances Hybrid System: 3 to 8 Outside (CO) Lines, 8 to 24 ExtensionsAdvances Hybrid System: 6 to 8 Outside (CO) Lines, 16 to 24 Extensions

Optional Service Cards KX-TE82461XKX-TE82474XKX-TE82480XKX-TE82483XKX-TE82491XKX-TE82492XKX-TE82493X

4-Port Doorphone Card8-Port Single Line Telephone Extension Card2-Port Analogue CO Line and 8-Port Single Line Telephone Extension Card3-Port Analogue CO Line and 8-Port Hybrid Extension CardMessage Expansion Card for DISA/UCD OGMs2-Channel Voice Message Card3-Port Caller ID Card

Proprietary Equipment KX-T30865KX-A227X

DoorphoneBackup Battery Cable

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5.2. SYSTEM CONNECTION DIAGRAM

Connect a display-equipped proprietary telephone (PT) to extension jack 01, as this extension is automatically designated asthe manager extension.

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6 NAMES AND LOCATIONS

7 CONNECTION

7.1. SERIAL INTERFACE CONNECTION

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8 DISASSEMBLY INSTRUCTIONS

8.1. DISASSEMBLY INSTRUCTION

1. Loosen the top cover screw (A).2. Remove the top front cover.Note

The screw cannot be removed front the cover.

3. Remove the 2 bottom-cover screws (B).

4. Open the bottom front cover.

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5. Remove the 2 screws (A).6. Remove the power supply board cover.7. Pull out the 4 connectors.8. Remove the 1 screw (D).9. Remove the power supply board.

10. Pull out the 1 connector.11. Remove the 2 screws (A) and (C).12. Remove the main board.

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Procedure:

Insert the SW CABLE into AC POWER SWICH.

Caution:

Be sure each colored wire is inserted to the correct lug (very important).

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9 BLOCK DIAGRAM

9.1. SYSTEM BLOCK DIAGRAM

Tone

Power

Sw

itc

h

DPH4Card

BV2

BV1

DOOR1

DOOR2

BVCard

OGMCard

Serial

Flash

PIO

CO

8

Int.CID

3

BV

2

BGM

1

D

PH

2

INT

4

Paig

ing

2

Tone

2

DTMF-R

2

DTMF-G

1

8port

Extension

Block

2port

Co

Block

PIO

8port

Extension

Block

3port

Co

Block

PIO

Cross

Po

int

DTMF-R

8port

Extension

Block

3port

Co

Block

CrossPoint

Flash

ROM

SRAM

CPU

DSP

SRAM

8Mbit

CN710

DSP#2

DSP#1

CN707

DPHBlo

ck#1,#2

PIO

DPHBlo

ck#3,#4

CN708

CIDCard

#3

FPGA

PIO

S/P

FSKDetectx3

Jackx8

CrossPoint

Jackx2

Jack

x8

Jackx3

Jackx8

Jackx3

DTMFDetect

StutterDetectx3

CID

Card

#1

Sameas

CID

Card

#3

CN706

CN711

CN712

3APCard

2APC

ard

1APCard

DTMF-G

forCO

CO1-3

ext1-8

CO4-6

ext9-16

CO7-8

ext17-24

RS232C

Bell

AC75V

25Hz

CN

600

Ext Paging

Ext Music

CN601

Hos

tI/F

ACIN

25Hz

+15V

-15V

+3.3

V

2

2

U

SB

Int.CIDx3

BGM

MODEM(Rx,

Tx)

OGM(Play,

Rec)x2

Voltage

check

Rectification

Rectification

battery

backup

circuit

O

vercurrent

D

etectcircuit

control

circuit

Voltage

change

noisefilter

L

N

FG

Surgeprotector

Ringer

Amp.

circu

it

C N7 0 5

24V GN D

Ex p a ns i o n Co n n e c t or

Ex p a ns i o n Co n n e c t or

DTMF-R

KX-TES824LA/KX-T

EM824LASYSTEMBLOC

KDIAGRAM

+27V

POWER

SUPPLY

IC601

L1,L2

Z1

IC8

IC7

IC2A~C

IC1A~C

IC7

IC600

,IC601

,IC602

IC613

IC614

IC511

IC512

IC500

IC501

IC502

IC704

IC705

IC701

IC702

IC703

IC700

IC10

IC6

IC705IC704

IC700

CN703

CN

704

IC1

IC2

IC3

IC4

CID

Card

#2

Sameas

CID

Card

#3

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9.2. POWER BLOCK DIAGRAM

9.3. KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM

CO CID

CONNECTOR

Door Phone

Door Opener

CONNECTOR

BV Card

CONNECTOR

Exp308

(2AP)

/Exp208

(3AP)

Card

EXP

CONNECTOR

OGM CardCONNECTOR

D-Sub

USB

POWER UNITCONNECTOR

25Hz

NINT AC

TONE(D)

(UART)RXD, TXD

(DSP)Serial Flash i/f

(APT i/f)PRX2-3, PTX2-3, PTXE1-3

CO4-8

Host

i/f

TAM1-2, TONE

DOOR1, 2

PIOASIC

CROSS

POINT

ROM

SRAM

ASIC

8086

DSP

PIO

APT i/f

BELL

(APT i/f)PRX,PTX,PTXE1-3

(I/O)HOOK1-8,BELL1-8

Q1-4,TOE1,2,STD1,2

TONE

620,440,350Hz

DTMFR(1,2)

(For EXT)

EXT1-8

BGM

PAGE

CO1-3

DTMFGenerator

(I/O) CO1

CO2

CO3

Paging jack

MOH jack

EXT1

EXT2

EXT3

EXT4

EXT5

EXT6

EXT7

EXT8

KX-TES824LA/KX-TEM824LA1AP BLOCK DIAGRAM

CN706

CN708

CN707

CN701, CN702

CN710

CN703

CN704

CN705

IC700

IC709

IC704

IC613, IC614

IC600

IC601

IC602

IC6

IC7

CN601

CN600

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9.4. KX-TEM824LA 2AP BLOCK DIAGRAM

Q1- 4,TOE1,2,STD1,2

CROSSPOINT

DTMFR(1,2)(For EXT)

PIOASIC

(I/O)HOOK9-16,BELL9-16

CO4-6

EXT9-16

(I/O)

Exp308

(2AP)

/Exp208

(3AP)

Card

EXP

CONNECTOR

CO4-6

(APT i/f)PRX2,PTX2,PTXE1-3

CID4-6

Host i/f CO4

CO5

CO6

EXT9

EXT11

EXT10

EXT12

EXT13

EXT14

EXT15

EXT16

KX-TEM824LA2AP BLOCK DIAGRAM

IC10

CN501, CN502

IC510, IC511

IC500, IC501, IC502

9.5. KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT BLOCK DIAGRAM

NoiseFilter

Rectification&

Smoothing

Controller

OverCurrent

Detection

Rectification&

Smoothing

Voltage

Detection

DC-DCConverter

RingerAmplifier

FG

SW

(14)

BatteryBack up

+24V

GND

+27V

GND

+15V

-15V

3.3V

OUTPUTAC75V 25Hz

INTPUT20/25Hz

ACAlarm

AC IN

L

N

AC InputPowerDown

Detection

Primary Circuit Secondary Circuit

Surge

Absorber

KX-TES824LA/KX-TEM824LAPOWER SUPPLY UNIT BLOCK DIAGRAM

CN1

F1

F2Z1 L1, L2

D10~D13, C5

D31

D32Q22

Q23

Q2

Q1 PC1

T1

D101, C101

PC31

IC601

Q201, T2, IC201

CN301

Q101

Q503

RL501

Q503

RL501

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10 EXPLANATION OF BLOCK DIAGRAM

10.1. MAIN UNIT (KX-TES824LA/KX-TEM824LA)

10.1.1. Power Supply Circuit

This power supply unit is a switching power supply. Power supply unit supplies DC voltage (+27V,+15V,-15V,3.3V) to main boardand other optional cards. And this unit has an adaptor circuit to back up battery. And this unit amplified the BELL signal (20/25Hz

sign wave outputted from the ASIC) and supply bell signal to the telephone.

10.1.2. COL Interface Circuit

There are the interface circuits linking the CO line (CO1 -CO3) and the cross point circuit section.

In case of KX-TEM824, the system has 6CO line (CO1 - CO6).

10.1.3. Cross Point Circuit

This is a space division switching system for connecting the following:

The eight extension circuits with the eight CO, DTMF generator, DTMF receiver, INT-CALL ID, MODEM, OGM, VB, paging, musicon hold, tone etc.

It is composed of 3 C-MOS ICs. (8 X 16 matrix: 2pcs and 4 X 8 matrix: 1pce).

*In case of KXTEM824, the system has 6 C-MOS ICs (8 X 16 matrix: 3pcs and 4 X 8 matrix: 2pce, 8 X 8 matrix: 2pce).

10.1.4. Intercom Circuit

This is the interface circuit of the single line telephone, and it is composed of 8 intercom circuit (ICM1-8) In case of KX-TEM824,the system has 16 intercom circuits(ICM1-16).

10.1.5. Power Failure Through Call Switching Circuit

KXTES824 have one power failure transfer circuit (CO1-EXT101).

In case of KXTEM824,the system has 2 power failure circuit (CO1-EXT101 CO4 -EXT109).

10.1.6. Data Communication Circuit

The APT i/f module which performs communication with a private telephone machine is built in ASIC.

8ch are controlled per block. Control of 3 blocks (24ch) is possible for ASIC at the maximum.

10.1.7. Control Circuit

A control block consists of only the [ASIC] CPU (compatibility with Intel 8086) (IC700), Flash ROM (8Mbit) (IC705), SRAM (4Mbit)(IC704), and PIO ASIC (IC6). PIO ASIC mainly performs extension control and PIO built in ASIC CPU mainly performs extensioncontrol. RTC (Real Time Clock) and SRAM inside CPU are backed up by the lithium battery in order to hold time, system data, etc.

10.1.8. Tone Generator Circuit

The rectangle wave generated by the timer of ASIC is changed into sine wave with a low path filter, and various tones aregenerated.

10.1.9. DTMF Generator Circuit

A DTMF generator is used for dispatch to outside line, and communication with the voice mail connected to the extension.

10.1.10. DTMF Receiver Circuit

The circuit which receives the Dial Tone Multi Frequency by which extension dispatch is carried out with the DTMF receiverconnected to the crossing point.

10.1.11. Int Call ID Circuit

FSK/Dial Tone Multi Frequency generated by DSP in ASIC are connected even to a crossing point through AMP. The circuit whichsends out a CALLID signal to the telephone connected to an extension by connecting the line of INT-CALL-ID with arbitraryextensions.

10.1.12. Modem Circuit

The MODEM signal generated by DSP in ASIC is connected even to a crossing point through AMP.

The circuit which connects the line of MODEM with arbitrary outside line, and enables MODEM communication with outside line.

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10.1.13. USB Circuit

The circuit which makes communication possible by PC and 1.1 standards by the USB controller in ASIC.

10.1.14. OGM Circuit

4M connected to ASIC by the memory controller in ASIC A maximum of 3-minute storing of OGM is possible to a serial flash Circuit.

10.1.15. Ring Signal Generator Circuit

This section generates the ring signal for the single line telephone. A 20/25Hz square wave is generated by the ASIC timer and sentto low pass filter and the ringing signal amplifier circuit and stepped by BELL transformer, and then passed it through the ringingsignal switching relay to the single line telephone.

10.1.16. SMDR Interface Circuit

This is the RS232C interface port. When the port is connected to a printer. The port can be used to output the SMDR featurerecording messages and the contents of the system program.

10.1.17. Door Phone Interface

An intercom card interface consists of two intercom paths connected to a crossing point, and address data and CS signals.

10.1.18. OGM Interface

An OGM card interface consists of the memory control signal, and the address data and CS signal which are connected to ASIC.

10.1.19. Call ID Interface

A CALLID card interface consists of three CALLID signal lines from outside line, and address data and CS signal.

10.1.20. BV Interface

BV card interface consists of two BV telephone call paths connected to a crossing point, and address data and CS signals.

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11 CIRCUIT OPERATION

11.1. POWER SUPPY CIRCUIT

11.1.1. The function of the power unit are listed below

AC-DC Inverter Function This function isolates and transduces the AC input voltage toDC input and output of DC27V.

DC-DC Converter Function This function outputs DC+15V, -15V and 3.3V from theinputted DC27V.

Ringing Signal Output Function Based on the 20/25Hz sine wave signal output from KX-TES824/KX-TEM824, this function generates ringing andsupplies to the system.

AC Power Failure Detection This function detects any cut off of the AC power supply andoutputs an AC alarm signal to the CPU.

Battery Back Up Adaptor Function This function connects battery and service unit without batteryadaptor, only needs a cable connected to the battery andservice unit.

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11.1.2. Control Section

1) AC-DC Inverter Function

The AC input voltage is rectified and smoothed by D10-13 and C5. The obtained DC voltage is converted into a rectangular waveby the switching transistor Q1, then isolated and transduced by T1. This converted rectangular wave is rectified and smoothed byD101 and C101 to output DC27V. The DC27V is transmitted to the primary side by PC1 and then PWM- controlled to keepconstant. The switching frequency of Q1 is approximately 100KHz (70KHz~160KHz).

2) DC-DC Inverter Function

The DC27V as input is converted into a rectangular wave by the switching transistor Q201, then isolated and transduced by T2.DC+15V, -15V and 3.3V are outputted by a rectification smoothing circuit composed of D401, D301, D701, C401, C301 and C702.The +3.3V of the three outputs is PWM-controlled by IC201 to keep constant.The switching frequency of the Q2 is approx. 55 KHz.

3) Ringing signal output function

Ringing signal (20/25Hz, 75Vac from main board) is amplified in power by power amplifier circuits (including of IC501, R601~R608,C601~C603).

Ringing signal amplified in power is transmitted to the ringing transformer through pin 4 of CN601.

4) AC Power Failure Detection

AC power failure is detected by D31~D32, R33~R41, C31, PC31.

When AC power is on, PC31 is on.

When AC power is turned off, PC31 is off.

5) Battery back up function

This back up battery adaptor circuit has DC supply function, from battery (+24V) to service unit and DC charge from service unitto battery (+24V). Charge current is typ. 0.4A.

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11.2. CO INTERFACE CIRCUIT

11.2.1. Composition

This is composed of the following circuit:

1) Bell signal detection

2) DC loop formation circuit

3) Pulse dial transmission circuit

4) CALL ID interface circuit

5) COL bidirectional amplifier circuit

1) Bell signal detection

When CO line is idle, photo coupler PC1, PC2 are OFF.

When there is an incoming signal from CO line, the current flows PC1 as in the following way.

Tip L1 R2 PC1(1-2) C3 T2 R5 L1 Ring: This cause pin4 of PC1 to change the level from High to low.

Ring L1 R5 T2 C3 PC2(1-2) R2 L1 Tip: This cause pin4 of PC2 to change the level from High to low.

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2) DC loop formation circuit

In the off hook status, PC5 is ON.

DC loop path:

TipL1D1D2D3Q10(E-C)Q1(C-E)R9R8D3L1Ring

At this time, the output of the photo coupler PC1 changes level from High to low.

RingL1D3R8R9Q1(E-C)Q10(C-E)D3D2D1L1Tip

At this time, the output of the photo coupler PC2 changes level from High to low.

Afterwards, G/A monitor this change (low level to high level). If the high level continues for a specified time set by system dataprogramming. G/A assumes that CO line has become On hook status. And the CO line circuits is restored to the idle status.

3) Pulse dial transmission circuit

When the Off hook status, pulse dial transmission is executed by alternating On hook and Off hook. The status of On hook orOff hook is controlled by the switching transistor Q10.

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4) CALL ID interface circuit

It is insulated by the transformer in a COL circuit, and the call ID signal inputted from outside line is transmitted to a CALLIDoption card.

The flow of a CALLID signal

TipL1R2PC1(1-2)C3T2R5L1Ring

RingL1R5T2C3PC2(1-2)R2L1Tip

5) COL Bidirectional Amplifier circuit

This circuit consists of bidirectional amplifier function for communication between the extensions and COL, returns loss

compensation for conference, shunt function and mute function.(Composition)

For transmitting signals from the extensions to COL, this circuit consists of R34, R35, R26, R27, R18, R29, C14, C15, C10, C16and the operational amplifier (IC1).

For transmitting signals from the COL to extensions, this circuit consists of R24, R25, R31, R28, R37, R30, C12, C13, C17, C18,and the operational amplifier (IC1).

COL side-tone suppression circuit which includes a balanced network BN1 consists of R22 R23, C11 and R16, R17, R20, R21.

EXT side-tone suppression circuit which includes a balanced network BN2 consists of R41, R42 and R40, R43, R38, R39.

Also extension side-tone suppression circuit which includes a balanced network BN3 consists of R45, R46 for supplementingside-tone suppression during the conference communication.

The analog switch (IC2) is used for the following:

(1) Conference (Pin 6, 8 and 9)

(2) Shunt (Pin 12, 10 and 11)

(3) Mute (Pin 13, 1 and 2)

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1) Conference switch

Normally, pin 6 of the analog switch IC2 is low level, but during conferences, this pin becomes high level. Because, duringconferences, it should compensate the return loss by connecting the balance network BN2 and the balance network BN3 inparallel.

2) Mute switch

The mute switch consists of pin 13, 1 and 2 of the analog switch(IC2). This switch has the following functions.

a) When a dial signal (DP) is sent to the COL, signals from the extensions are blocked.

b) When the hold on music is sent to the COL, signals from the extensions are blocked.

c) When the COL interface circuit is in the idle state, oscillation of COL bidirectional amplifier is inhibited. When pin 13 of IC2changes to low level, the interval between pins 1 and 2 of the analog switch turns off, and signals are blocked.

3) Shunt switch

The shunt switch consists of pin 12, 10 and 11 of analog switch IC2.It is used to prevent the pulse dialing signal which is

transmitted to the extensions. When pin 12 of IC2 changes to high from low, the analog switch becomes ON (the intervalbetween pin 10 and 11), and GAIN of the COL cross point operational amplifier becomes zero.

Shunt SW Mute SW Conference SW

pin no. of analog switch 12 13 6No connection (idle) H (on) L (off) L (off)

Two party call L (off) H (on) L (off)

Conference L (off) H (on) H (on)

Hold on music transmission L (off) H (on) L (off)

Condition of COL interface amplifier circuit and analog switches.

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11.3. CROSS POINT SWITCH CIRCUIT

11.3.1. Composition

The cross point circuit composed of three cross point switch ICs (IC600 and 601:8X16, IC602:4X8).

*In case of KX-TEM824, the system add more cross point switch ICs (IC500:8X16, IC501:8X8, IC502:4X8) which are in KX-TE82483.

1) Cross Point Switch IC Operation

The cross point SW (IC600, IC601) contains a 8X16 array of cross point switches along with a 7 to 128 line decoder and latchcircuits. Any one of the 128 switches can be addressed by selecting appropriate seven address bits. The selected switch canbe turned on or off by applying either logical one or zero to the DATA input. Chip select allows the cross point array to becascaded for matrix expansion. Start a new line at this point SWs (IC602) contain 4X8 array of cross point switches along witha 5 to 32 line decoder and latch circuits.

Any one of the 32 switches can be addressed by selecting appropriate five address bits. The selected switch can be turned onor off by applying either logical one or zero to the DATE input. Chip select allows the cross point array to be cascaded for matrixexpansion.

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11.4. INTERCOM CIRCUIT

11.4.1. INTERCOM CIRCUIT

1) Composition

This is composed of the following circuits:

a) +15V power source for the extension telephones

b) Hook detect for SLT and pulse dialing detect

c) Bell ring trip section

2) Circuit operation

a) Power supply to the telephone

With the telephone off hook, a DC loop is formed, and current is supplied to the telephone. This circuit is limited to about 30mAby Q200, Q202, R202, R204 and Q201, Q203, R203, R205.

+15VR204R202Q200RL201telephoneRL201Q201R203R205-15V

b) Hook detect for SLT and pulse dialing detect

When the telephone handset is taken off, DC loop is formed and the collector of U200 3,6 pin change to L from H.

The ASIC detects the off hook condition.When the handset is replaced back on hook, the DC loop is interrupted and collector of U200 3,6 pin change to H from L andEXT Pulse dialing is input either in the on hook or off hook condition, and the break number (on hook condition) is counted andread as the dial number.

c) Bell ringing trip section

When the telephone is a signal line telephone, extension calling is executed by means of a ringing signal. When the ringingsignal is supplied, RL201 turns ON and the current flows are as follows:

Bell transformerringing signal line RL201 telephone R206 -15V Bell transformer

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11.5. POWER FAILURE THROUGH CALL SWITCHING CIRCUIT

11.5.1. Circuit operation

If an AC power failure lasts longer than one second (momentary power failure), the COL is directly connected to the extension.The COL1 will be connected with EXT101.

When power failure, RL200 switches from EXT-line to CO [T/R].

*In case of KX-TEM824, and the COL4 will be connected with EXT109.

*In case of KX-TE82480, and the CO7 will be connected with EXT117.

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11.6. DATA COMMUNICATION CIRCUIT

11.6.1. Composition

This circuit is composed of the ASIC and the data communication interface circuits for the ICM circuit.

11.6.2. Circuit Operation

1) Data Communication of ASIC

The APT I/f module is built into the CPU. It is for the APT communication of one block (8ch) and has the module of three blocks(24ch) at maximum.

Selection signal of 3 bits to select 1ch out of 8chs is common to each block.

The APT I/f module switches the communication point every 4ms in the ports 1-8/9-16/17-24 of the extension as follows:

#101#102#103#104.....#108#101.....,

#109#110#111#112.....#116#109.....,

#117#118#119#120.....#124#117.....,

In the case where the extension is not connected with the APT, it is recognized as an SLT connection and a dummycommunication is performed.

Interface block diagram of ASIC and ICM

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2) Data Communication of ASIC and PITS

When ASIC send the request signal to the proprietary telephone and after receiving the key input information (19 pulses) fromthe proprietary telephone and sending data (47 pulses) for LED control. 4bit CPU will receive acknowledge signal from theproprietary telephone.

a) Reception

The data from the proprietary telephone is received via H and L lines along the path shown below.

H.L line C208 IC200 T201 R235 Q210 ASIC

b) TransmissionThe data to the proprietary telephone is transmitted along the following Path.

ASIC Q209 Q215 T201 IC200 C208 H.L line

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11.7. CONTROL CIRCUIT

11.7.1. Composition

The control block is composed of the 16bit CPU(IC700: operating on 23.966MHz system clock from the 47.936MHz external crystaloscillator), the 8Mbit Flash ROM, the 4Mbit SRAM, and the ASIC for the I/O Port to control the outside line.

The port to control the extension, the clock IC, the address decoder, and other CPU Peripheral circuit are included in theIC700.Also, the IC700 includes functions such as Extension CID(FSK, DTMF), MODEM sending/receiving, BGM, OGM

recording/playing, DTMF tone, CNG tone, CPT tone, and VOX detection.The SRAM has a lithium battery to back up information such as speed dial, date, dial data, and system data etc. The battery alsobacks up the clock IC in the IC700.

I/O Port to control extension circuit, clock IC, address decoder, and other CPU Peripheral function are included in IC700. And IC700include the functions as transmission of Extension Caller ID, transmission & receive of MODEM, transmission BGM, recording &playing of OGM, detect of DTMF tone, CNG tone, CPT tone & VOX.

the SRAM has a lithium battery as back up for protection of the memory of information of such as the speed dial, date, dial data,and system data, etc. This battery is back up clock IC in IC700 too.

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11.8. TONE GENERATOR CIRCUIT

11.8.1. Composition

This system has three different tones, 620Hz, 440Hz, 350Hz.

ASIC make the 350Hz, 620Hz and 440Hz square wave signals.

The 350Hz and 440Hz square wave signals are shaped by the low pass filter to sin wave and become tone 1.

On the other hand, 620Hz, square wave signal is shaped by the low pass filter to sin wave and becomes tone 2.

Tone signals 1 and 2 turn ON and OFF at the cross point, thus dial tone, busy tone, and other tones, are produced.

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11.9. DTMF GENERATOR CIRCUIT

11.9.1. Composition

DTMF generator is controlled by the 8 bit I/O data of CO G/A. DTMF tone is sent to CO line.

DTMF GENERATOR

R1 R2 R3 R4 C1 C2 C3 C4 TRANSMIT SIGNAL

L L L L L L L L DISABLE

H L L L H L L L 1

H L L L L H L L 2

H L L L L L H L 3L H L L H L L L 4L H L L L H L L 5

L H L L L L H L 6

L L H L H L L L 7

L L H L L H L L 8

L L H L L L H L 9

L L L H L H L L 0

L L L H H L L L *L L L H L L H L #

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11.10. DTMF RECEIVER CIRCUIT

11.10.1. Composition

The DTMF receiver circuit is composes of four DTMF receivers.

IC613 and IC614 are used for the DTMF receivers from SLT connected to the extension.

The DTMF signal is the 4bit parallel data and read by ASIC.

*In case of KX-TEM824, the system have two more DTMF receiver which are in KX-TE82483.

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11.11. INT CALLID INTERFACE CIRCUIT

By using the DSP built into the ASIC, it is possible to produce CALLID signal and send it through the cross point to each extension.

The CALLID signal can be switched between FSK and DTMF. There are three sources of the extension CALL ID in the system.

11.12. MODEM INTERFACE CIRCUIT

The ASIC incorporates a modem function. There is no specified line and modem communication from any line is possible. Themodem communication speed is 2400bps and the system programming rewrite can be operated at the equivalent of 9600bps atmaximum by using software compression technology.

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11.13. USB INTERFACE CIRCUIT

This unit have one USB port for using PC programming. ASIC have USB 1.1 controller inside, so this unit make up USB interfaceonly ASIC and USB connector.

11.14. OGM INTERFACE CIRCUIT

The TES/TEM824 model incorporates the functions of OGM, CNG and DTMF detection. At the OGM recording, it changes theanalog sound in the DSP of the ASIC into a digital signal of 16bits by A/D conversion. Then, the data is compressed (encoded) andstored in a 4M serial flash. Conversely, when being recovered the data stored in the 4M serial flash are decompressed to 16-bitdigital data, and then reproduced as an analog sound after the D/A conversion. The recording/reproducing is achieved byconnecting the path from external line through the cross point to the ASIC.The waveform coding method used at therecording/reproducing stage is the LD-ADPCM method. The DSP compresses the sound and stores the 4M serial flash using thememory management software in the DSP. The unit has the recording/reproducing function of 1CH as an initial mounting.Therecording time of the OGM is three minutes at maximum.

Also, the CNG and DTMF detection are the functions operated in conjunction with the OGM and realized by the DSP in the ASIC.

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11.15. RINGING SIGNAL GENERATOR CIRCUIT

This section generates this ringing signal for the single line telephone. A 25Hz square wave is generated by the ASIC and sent tolow pass filter and ringing signal amplifier circuit and stepped by BELL transformer, and then passed through the ringing signalswitching relay to the single line telephone.

11.16. SMDR INTERFACE CIRCUIT

This is the RS-232C interface port. When the port is connected to a printer, the port can be used to output the SMDR featurerecording messages and the contents of the system program.

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11.17. DOORPHONE CARD INTERFACE (KX-TE82461X)

This mounts a connector to connect the door phone card. Power at +15V, 3.3V and VAG are supplied to the door phone. Also, twobusses are supplied from the cross point to the door phone card.

The tone for calling the door phone is directly supplied to the door phone and the ON/OFF control is performed in the door phone.

11.18. OGM CARD INTERFACE (KX-TE82491X)

The CN710 is the interface connector for the expansion card to convert the OGM to 2CH. The unit can have the OGM of 2ch bymounting the option card KX-TE82491.

Also, the recording time of the OGM can be extended to eight minutes at maximum.

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11.19. BUILT in VOICE MESSAGE CARD INTERFACE (KX-TE82492X)

The CN707 is the interface connector for the option card KX-TE82492 that has the MESSAGE of 2ch.

The MESSAGE can be recorded from the external line or the extension. The recording time is 60 minutes for 1CH at maximum.

11.20. CALL ID CARD INTERFACE (KX-TE82493X)

The TES/TEM824 system has three connectors to connect the Caller ID card to the external line in the main unit. One is for threeexternal lines mounted on the main card and the others are for 2AP and 3AP.

The interface for the CALL ID of the external line is composed of an interface for receiving the CALLID signal from a station anda controller of the main card.The CALLID signal from the external line is transmitted through a transformer in the external line circuitto the CALLID connector. The control signals of CS, Address and Data are connected to the connector.

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12 TROUBLESHOOTING GUIDE

12.1. NO OPERATION (Check POWER SUPPLY BOARD, MAIN BOARD)

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12.2. NO DIAL TONE (KX-TES824LA, MAIN BOARD OF KX-TEM824LA)

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12.3. CANNOT DIAL (KX-TES824LA, MAIN BOARD OF KX-TEM824LA)

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12.4. CANNOT CALL EXTENSION (KX-TES824LA, MAIN BOARD OF KX-

TEM824LA)

12.5. CANNOT USE PROPRIETARY TELEPHONE (KX-TES824LA, MAIN

BOARD OF KX-TEM824LA)

12.6. CANNOT RECEIVE INCOMING CALL (KX-TES824LA, MAIN BOARD OF

KX-TEM824LA)

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12.7. CANNOT SEND DTMF DIALING (KX-TES824LA, MAIN BOARD OF KX-

TEM824LA)

12.8. CANNOT RECEIVE CALL DIAL TONE (KX-TES824LA, MAIN BOARD OF

KX-TEM824LA)

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12.9. CANNOT SEND A HOLD ON MUSIC (KX-TES824LA, MAIN BOARD OF

KX-TEM824LA)

12.10. NO DIAL TONE (SUB BOARD OF KX-TEM824LA)

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12.11. CANNOT DIAL (SUB BOARD OF KX-TEM824LA)

12.12. CANNOT CALL EXTENSION (SUB BOARD OF KX-TEM824LA)

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12.13. CANNOT USE PROPRIETARY TELEPHONE (SUB BOARD OF KX-

TEM824LA)

12.14. CANNOT RECEIVE INCOMING CALL (SUB BOARD OF KX-TEM824LA)

12.15. CANNOT SEND DTMF DIALING (SUB BOARD OF KX-TEM824LA)

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12.16. CANNOT RECEIVE CALL DIAL TONE (SUB BOARD OF KX-TEM824LA)

12.17. CANNOT SEND A HOLD ON MUSIC (SUB BOARD OF KX-TEM824LA)

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13 IC DATA

13.1. IC700

PIN No Pin Name I/O Function

127 Q1 I DTMF Rx Data[0]

128 Q2 I DTMF Rx Data[1]129 Q3 I DTMF Rx Data[2]

130 Q4 I DTMF Rx Data[3]

131 STD1 I DTMF-R1 Status132 STD2 I DTMF-R2 Status133 TOE1 O DTMF-R1 Data output Enable

134 TOE2 O DTMF-R2 Data output Enable

135 BELL1 O Ext BELL Control 1





144 BELL6 O Ext BELL Control 6145 BELL7 O Ext BELL Control 7


147 HOOK1 I Ext Hook Detect 1




151 HOOK5 I Ext Hook Detect 5152 HOOK6 I Ext Hook Detect 6



155 SYSCLR I System Clear

158 DET_EXT I Extension 08/208 Card Detection

159 DET_308 I Extended 308 Card Detection

160 DET_OGM I OGM Card Detection161 LED_SW O LED ON

162 PAG_SW O External Paging Output

163 OUT232C O Control Port for RS232C

164 NRESET O ALL Module Reset94 USB_VBUS I Power Supply Monitor; 0: Detected, 1: Not detected

95 USB_PUP O Pullup Control

96 PD_RLY O SW Relay for Power Down

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97 MOH_SW O External B6M Input

98 BREAK O Line 1.5V Disconnection, 0: Disconnected, 1: Connected99 IN232C I Monitor Port for RS232C

100 NC - -

103 NC - -

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13.2. IC6


4 CDT1 I Current Detect1

5 CDT2 I Current Detect2

6 CDT3 I Current Detect37 DET_DOOR I Door Phone Card Detect8 NINT_AC I AC Power-off Detection Signal

9 NINT_DC I DC Power-off Detection Signal

10 OGM_SW O Connected to the extension

11 BLRLY O BELL Disconnection; 0: Disconnected, 1: Connected

13 CO1_VAG O Connected to VAG


15 CO3_VAG O Connected to VAG16 CO4_VAG O Connected to VAG17 CO5_VAG O Connected to VAG




21 CLM1 O Column Input 1

24 CLM2 O Column Input 2

25 CLM3 O Column Input 326 CLM4 O Column Input 4

27 ROW1 O Row Input 1




36 CONF3 O Conference37 MUTE3 O Send MUTE38 DL3 O Pulse Dial

39 DS3 O Dial Shunt

40 SHUNT3 O Receive Mute

41 PAD3 O 3dB PAD

44 BELLA3 I Bell Detect A

45 BELLB3 I Bell Detect B

46 CONF2 O Conference47 MUTE2 O Send MUTE

48 DL2 O Pulse Dial

49 DS2 O Dial Shunt

50 SHUNT2 O Receive Mute

51 PAD2 O 3dB PAD

53 BELLA2 I Bell Detect A54 BELLB2 I Bell Detect B

55 CONF1 O Conference56 MUTE1 O Send MUTE

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57 DL1 O Pulse Dial

58 DS1 O Dial Shunt59 SHUNT1 O Receive Mute

60 PAD1 O 3dB PAD

61 BELLA1 I Bell Detect A

64 BELLB1 I Bell Detect B

31 DET_CID1 I CID Card Detect(1AP)

32 DET_CID2 I CID Card Detect(2AP)

34 DET_CID3 I CID Card Detect(3AP)35 DET_TAM I Voice Message Card(10min)

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14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

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15.1. PREPARATION

PbF (: Pb free) Solder

Soldering Iron

Tip Temperature of 700F 20F (370C 10C)

Note: We recommend a 30 to 40 Watt soldering iron. Anexpert may be able to use a 60 to 80 Watt iron wheresomeone with less experience could overheat and damagethe PCB foil.

Flux

Recommended Flux: Specific Gravity0.82.

Type RMA (lower residue, non-cleaning type)

Note:See ABOUT LEAD FREE SOLDER (PbF: Pb free)(P.5).

15.2. REMOVAL PROCEDURE 1. Put plenty of solder on the IC pins so that the pins can be

completely covered.

Note:

If the IC pins are not soldered enough, you may givepressure to the P.C. board when cutting the pins with acutter.

2. Make a few cuts into the joint (between the IC and its pins)first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solderleft on the land with some tools like a soldering wire. If some

solder is left at the joint on the board, the new IC will not beattached properly.

15.3. INSTALLATION PROCEDURE

1. Tack the flat pack IC to the PCB by temporarily solderingtwo diagonally opposite pins in the correct positions on thePCB.

Be certain each pin is located over thecorrect pad on the PCB.

2. Apply flux to all of the pins on the IC.

3. Being careful to not unsolder the tack points, slide thesoldering iron along the tips of the pins while feedingenough solder to the tip so that it flows under the pins asthey are heated.

15.4. REMOVING SOLDER FROM

BETWEEN PINS

1. Add a small amount of solder to the bridged pins.

2. With a hot iron, use a sweeping motion along the flat part ofthe pin to draw the solder from between the adjacent pads.

15 HOW TO REPLACE A FLAT PACKAGE ICEven if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount),a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

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16 FIXTURES AND TOOLS

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17 CABINET AND ELECTRICAL PARTS LOCATION

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18 ACCESSORIES AND PACKING MATERIALS

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19 REPLACEMENT PARTSLIST (KX-TES824LA/KX-TEM824LA)

Note:

1. RTL (Retention Time Limited)

The marking (RTL) indicates that the Retention Time islimited for this item.

After the discontinuation of this assemb ly in production, theitem will continue to be available for a specific period oftime. The retention period of availability depends on thetype of assembly and the laws governing parts and productretention. At the end of this period, the assembly will nolonger be available.

2. Important safety notice

Components identified by the mark indicates specialcharacteristics important for safety. When replacing any ofthese components, only use specified manufactures parts.

3. The S mark means the part is one of some identical parts.For that reason, it may be different from the installed part.

4. ISO code (Example: ABS-94HB) of the remarks columnshows quality of the material and a flame resisting gradeabout plastics.

5. RESISTORS & CAPACITORS

Unless otherwise specified;

All resistors are in ohms (), k=1000, M=1000k

All capacitors are in MICRO FARADS (F), p=(F)

*Type & Wattage of Resistor

19.1. CABINET AND ELECTRICAL

PARTS

Ref.

No.

Part No. Part Name & Description Remarks

1 PQHD10011V SMALL SCREW

2 PSGG1009Z1 GRILL PS

3 PSGG1009Y1 GRILL (KX-TEM824LA) PS

4 PSHE1051Z SPACER

5 PSHE1068Z NUT

Ref.

No.


6 PSHR1146Z SPACER, LED PS

7 PSHR1336Z SPACER, PCB HOLDER PA66

8 PSJS02Q11Z CONNECTOR, 2P

9 PSJS11P24Z CONNECTOR, 11P

10 PSKE1020X1 COVER, POWER BOARD PS

1 1 P SK F1 03 0S 1 C AB IN ET CO VE R ( KX -T ES 82 4L A) P S

1 1 P SK F1 03 0R 1 C AB IN ET CO VE R ( KX -T EM 82 4L A) P S

12 PSKM1056U1 CABINET BODY PS

13 PSKV1010Z1 COVER, CABLE PS

14 PSLT1K9M2A TRANSFORMER

15 PSMH1135Y ANGLE

16 PSMH1151Y ANGLE

17 PSQT1546Z LABEL, CAUTION

18 PSQT1545Z LABEL, BATTERY

19 PSQT1547Z LABEL, WARNING

20 PSUS1022Z COIL SPRING

2 1 P SW ST ES 82 4B X S WI TC H A SS Y

22 PSYETES824LA NAME PLATE (KX-TES824LA)

22 PSYETEM824LA NAME PLATE (KX-TEM824LA)

23 XUC3VW RETAINING RING

24 K1KA40A00234 CONNECTOR (KX-TEM824LA)

25 PQLB5F1 INSULATOR

19.2. ACCESSORIES AND PACKINGMATERIALS

Ref.

No.


A1 PSJA1007Z POWER CORD

A2 PSJA1081Z POWER CORD

A3 PQJP1E1Z PLUG

A4 PQHE5004Z WOOD SCREW

A5 XWG35FY WASHER

A6 PSHE1071Z BAND

A7 PSQX3609ZCD INSTRUCTION BOOK, CD-ROM

A8 PSQX3414Z INSTRUCTION BOOK

A9 PSHR1177Z RIVET

P1 PSZKTES824LA P ACKING CASE, CARTON BOXASSY (KX-TES824LA)

P1 PSZKTEM824LA P ACKING CASE, CARTON BOX

ASSY (KX-TEM824LA)

P2 PSPN1089Z ACCESSORY BOX, PAPER

P3 PSPD1143Z CUSHION

P 4 X ZB 06 X1 3A 03 P RO TE CT IO N C OV ER

P5 XZB30X40A04 PROTECTION COVER, MANUAL PACK

P 6 X ZB 05 X0 8A 03 P RO TE CT IO N C OV ER

P7 PSPP1050Z PROTECTION COVER

19.3. MAIN BOARD PARTS

Ref.

No.


PCB1 PSWPTES824LA MAIN BOARD ASSY (RTL)

(ICS)

IC1A PQVINJM4558V IC S

IC1B PQVINJM4558V IC S

IC1C PQVINJM4558V IC S

IC2A PSVICD4066BS IC S

IC2B PSVICD4066BS IC S

IC2C PSVICD4066BS IC S

IC6 C1CB00001851 IC

IC7 C1CB00001866 IC

IC200 PQVIMC4051BF IC S

IC600 PSVIMT8816AP IC S



IC604 PQVINJM4558V IC S



IC607 PSVICD4066BS IC S



60



61/289

Ref.

No.





IC613 C1CB00001876 IC

IC614 C1CB00001876 IC



IC700 C1CB00001853 IC

IC701 C0CBAKE00010 IC

IC702 C0CBAAC00083 IC

IC703 C0CBAAC00154 IC

IC704 C3BBKG000086 IC

IC705 PSWITES824LA IC

IC706 C3FBKC000127 IC

IC707 C1CB00001825 IC

IC708 PQVITC7SU04F IC S


IC710 C0JBAB000407 IC

IC712 C0EBE0000176 IC

IC713 C0JBAC000382 IC


IC715 C0JBAC000382 IC


(TRANSISTORS)Q1A 2SC4731S TRANSISTOR(SI) S

Q1B 2SC4731S TRANSISTOR(SI) S

Q1C 2SC4731S TRANSISTOR(SI) S

Q5A UN5213 TRANSISTOR(SI) S

Q5B UN5213 TRANSISTOR(SI) S

Q5C UN5213 TRANSISTOR(SI) S

Q10A 2SA1627 TRANSISTOR(SI) S

Q10B 2SA1627 TRANSISTOR(SI) S

Q10C 2SA1627 TRANSISTOR(SI) S

Q200A 2SB766ARTX TRANSISTOR(SI) S

Q200B 2SB766ARTX TRANSISTOR(SI) S

Q200C 2SB766ARTX TRANSISTOR(SI) S

Q200D 2SB766ARTX TRANSISTOR(SI) S

Q200E 2SB766ARTX TRANSISTOR(SI) S

Q200F 2SB766ARTX TRANSISTOR(SI) SQ200G 2SB766ARTX TRANSISTOR(SI) S

Q200H 2SB766ARTX TRANSISTOR(SI) S

Q201A 2SD874A TRANSISTOR(SI) S

Q201B 2SD874A TRANSISTOR(SI) S

Q201C 2SD874A TRANSISTOR(SI) S

Q201D 2SD874A TRANSISTOR(SI) S

Q201E 2SD874A TRANSISTOR(SI) S

Q201F 2SD874A TRANSISTOR(SI) S

Q201G 2SD874A TRANSISTOR(SI) S

Q201H 2SD874A TRANSISTOR(SI) S

Q 20 2A 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 2B 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 2C 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 2D 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 2E 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 2F 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 2G 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 2H 2 SB 121 8A TR AN SI ST OR (S I)

Q 20 3A 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 3B 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 3C 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 3D 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 3E 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 3F 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 3G 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 3H 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7A 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7B 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7C 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7D 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7E 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7F 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7G 2 SD 181 9A TR AN SI ST OR (S I)

Q 20 7H 2 SD 181 9A TR AN SI ST OR (S I)

Ref.

No.


Q209 PQVTDTC143E TRANSISTOR(SI) S

Q 20 9A 2 SD 18 19 A T RAN SI ST OR (S I)

Q 20 9B 2 SD 18 19 A T RAN SI ST OR (S I)

Q 20 9C 2 SD 18 19 A T RAN SI ST OR (S I)

Q 20 9D 2 SD 18 19 A T RAN SI ST OR (S I)

Q 20 9E 2 SD 18 19 A T RAN SI ST OR (S I)

Q 20 9F 2 SD 18 19 A T RAN SI ST OR (S I)

Q 20 9G 2 SD 18 19 A T RAN SI ST OR (S I)

Q 20 9H 2 SD 18 19 A T RAN SI ST OR (S I)

Q210 2SD1819A TRANSISTOR(SI)




Q215 PQVTDTA114EU TRANSISTOR(SI) S



Q222 2SB1417P TRANSISTOR(SI) S


Q608 UN5213 TRANSISTOR(SI) S





Q702 B1GDCFNA0001 TRANSISTOR(SI)Q703 PQVTDTC144E TRANSISTOR(SI) S

Q704 2SC2412K TRANSISTOR(SI) S


U2A B1GFAFNN0001 TRANSISTOR(SI)

U2B B1GFAFNN0001 TRANSISTOR(SI)

U2C B1GFAFNN0001 TRANSISTOR(SI)

U200A PSVTUMX1NTN TRANSISTOR(SI)

U200B PSVTUMX1NTN TRANSISTOR(SI)

U200C PSVTUMX1NTN TRANSISTOR(SI)

U200D PSVTUMX1NTN TRANSISTOR(SI)

U200E PSVTUMX1NTN TRANSISTOR(SI)

U200F PSVTUMX1NTN TRANSISTOR(SI)

U200G PSVTUMX1NTN TRANSISTOR(SI)

U200H PSVTUMX1NTN TRANSISTOR(SI)

U600 B1GFAFNN0001 TRANSISTOR(SI)U601 B1GFAFNN0001 TRANSISTOR(SI)

U602 B1GFAFNN0001 TRANSISTOR(SI)

U603 B1GFAFNN0001 TRANSISTOR(SI)

(DIODES)

D 1A P SV DH ZK 2B TR D IOD E( SI )

D 1B P SV DH ZK 2B TR D IOD E( SI )

D 1C P SV DH ZK 2B TR D IOD E( SI )

D 2A P SV DH ZK 2B TR D IOD E( SI )

D 2B P SV DH ZK 2B TR D IOD E( SI )

D 2C P SV DH ZK 2B TR D IOD E( SI )

D3A B0EDKT000001 DIODE(SI)

D3B B0EDKT000001 DIODE(SI)

D3C B0EDKT000001 DIODE(SI)

D202A MA8036H DIODE(SI) S

D202B MA8036H DIODE(SI) S

D202C MA8036H DIODE(SI) S

D202D MA8036H DIODE(SI) S

D202E MA8036H DIODE(SI) S

D202F MA8036H DIODE(SI) S

D202G MA8036H DIODE(SI) S

D202H MA8036H DIODE(SI) S

D203A MA8036H DIODE(SI) S

D203B MA8036H DIODE(SI) S

D203C MA8036H DIODE(SI) S

D203D MA8036H DIODE(SI) S

D203E MA8036H DIODE(SI) S

D203F MA8036H DIODE(SI) S

D203G MA8036H DIODE(SI) S

D203H MA8036H DIODE(SI) S

D204A MA8039 DIODE(SI) S

D204B MA8039 DIODE(SI) S

D204C MA8039 DIODE(SI) S

D204D MA8039 DIODE(SI) S

D204E MA8039 DIODE(SI) S

61



62/289

Ref.

No.


D204F MA8039 DIODE(SI) S

D204G MA8039 DIODE(SI) S

D204H MA8039 DIODE(SI) S





















D209E MA111 DIODE(SI) SD209F MA111 DIODE(SI) S



D220 MA111 DIODE(SI) S



D600 B0BC2R400008 DIODE(SI)

D601 B0BC2R400008 DIODE(SI)





D 60 6 M AZ 80 62 0L L DI OD E( SI )

D 70 1 M AZ 82 00 0M L DI OD E( SI )

D702 MA111 DIODE(SI) SD703 MA728 DIODE(SI) S



DA200A MA142WKTX DIODE(SI) S

DA200B MA142WKTX DIODE(SI) S

DA200C MA142WKTX DIODE(SI) S

DA200D MA142WKTX DIODE(SI) S

DA200E MA142WKTX DIODE(SI) S

DA200F MA142WKTX DIODE(SI) S

DA200G MA142WKTX DIODE(SI) S

DA200H MA142WKTX DIODE(SI) S

LED700 B3ABB0000146 LED

(BATTERY)

BAT700 CR23541GUF LITHIUM BATTERY

(CONNECTORS)

CN701 K1KB40C00002 CONNECTOR, 40P

CN702 K1KB40C00002 CONNECTOR, 40P

CN703 PSJP09A64Z CONNECTOR, 9P S

CN704 K1KB04B00036 CONNECTOR, 4P

CN705 PQJP11G30Z CONNECTOR, 11P S

CN706 K1KA30A00196 CONNECTOR, 30P


CN708 PQJP30A09Z CONNECTOR, 30P




(COMPONENTS PARTS)

RA100 D1H81034A010 RESISTOR ARRAY, 10K







Ref.

No.



RA700 D1H81034A010 RESISTOR ARRAY, 68






















RA723 D1H81034A010 RESISTOR ARRAY, 10KRA724 D1H86804A024 RESISTOR ARRAY, 68






(COILS)

L1A PFLE003 COIL S

L1B PFLE003 COIL S

L1C PFLE003 COIL S

L204A PQLQXH152J COIL S

L204B PQLQXH152J COIL S

L204C PQLQXH152J COIL S

L204D PQLQXH152J COIL S

L204E PQLQXH152J COIL SL204F PQLQXH152J COIL S

L204G PQLQXH152J COIL S

L204H PQLQXH152J COIL S

L703 G1C1R0ZA0021 COIL

TH1A PQLE106 COIL S

TH1B PQLE106 COIL S

TH1C PQLE106 COIL S

(CRYSTAL OSCILLATORS)

X600 PSVCYY0358M3 CRYSTAL OSCILLATOR S

X700 H0J479500001 CRYSTAL OSCILLATOR

X701 PSVCC0019CT C RYSTAL OSCILLATOR S

(FILTERS)

FIL701 J0HAAH000003 IC FILTER






L600 PFVF1A471SG CERAMIC FILTER




L704 PFVF1B221SB CERAMIC FILTER












62



63/289

Ref.

No.

























L740 PFVF1B221SB CERAMIC FILTERL741 PFVF1B221SB CERAMIC FILTER



(FUSES)

TH2A D4FAR1700002 FUSE

TH2B D4FAR1700002 FUSE

TH2C D4FAR1700002 FUSE

TH2D D4FAR1700002 FUSE

TH2E D4FAR1700002 FUSE

TH2F D4FAR1700002 FUSE

TH2G D4FAR1700002 FUSE

TH2H D4FAR1700002 FUSE

(JACKS)

CN1A PQJJ1T004Z JACK S

CN1B PQJJ1T004Z JACK SCN1C PQJJ1T004Z JACK S

CN200A PQJJ1T011Y JACK S

CN200B PQJJ1T011Y JACK S

CN200C PQJJ1T011Y JACK S

CN200D PQJJ1T011Y JACK S

CN200E PQJJ1T011Y JACK S

CN200F PQJJ1T011Y JACK S

CN200G PQJJ1T011Y JACK S

CN200H PQJJ1T011Y JACK S

CN600 PSJJ1D001Z JACK S

CN601 PSJJ1D001Z JACK S

(TRANSFORMERS)

T1A G4A1A0000173 TRANSFORMER

T1B G4A1A0000173 TRANSFORMER

T1C G4A1A0000173 TRANSFORMER

T2A G4A1A0000177 TRANSFORMER

T2B G4A1A0000177 TRANSFORMER

T2C G4A1A0000177 TRANSFORMER

T200A ETA14Y85AY TRANSFORMER

T200B ETA14Y85AY TRANSFORMER

T200C ETA14Y85AY TRANSFORMER

T200D ETA14Y85AY TRANSFORMER

T200E ETA14Y85AY TRANSFORMER

T200F ETA14Y85AY TRANSFORMER

T200G ETA14Y85AY TRANSFORMER

T200H ETA14Y85AY TRANSFORMER

T 20 1 E TE 13K 24 AY TR AN SF OR ME R

(PHOTO ELECTRIC TRANSDUCERS)

PC1A PQVIP27011M3 PHOTO COUPER S

PC1B PQVIP27011M3 PHOTO COUPER S

PC1C PQVIP27011M3 PHOTO COUPER S




Ref.

No.





PC5A CNC2S5020LL1 PHOTO COUPER

PC5B CNC2S5020LL1 PHOTO COUPER

PC5C CNC2S5020LL1 PHOTO COUPER

(RELAYS)

RL200A K6B2CGA00121 RELAY

RL201A PQSL41Z RELAY S

RL201B PQSL41Z RELAY S

RL201C PQSL41Z RELAY S

RL201D PQSL41Z RELAY S

RL201E PQSL41Z RELAY S

RL201F PQSL41Z RELAY S

RL201G PQSL41Z RELAY S

RL201H PQSL41Z RELAY S

RL202A K6B2CGA00095 RELAY S

(SWITCHES)

SW1 EVQ21409K SPECIAL SWITCH

SW2 PQSS2A04W SLIDE SWITCH S

(VARISTORS)

SA1A J0LE00000043 VARISTOR (SURGE ABSORBER)

SA1B J0LE00000043 VARISTOR (SURGE ABSORBER)

SA1C J0LE00000043 VARISTOR (SURGE ABSORBER)S A1 00 P FR ZR A1 02 P6 T V ARI ST OR (S UR GE A BS OR BE R) S

ZNR2A D4EAB820A005 VARISTOR

ZNR2B D4EAB820A005 VARISTOR

ZNR2C D4EAB820A005 VARISTOR

ZNR200 D4EAB220A005 VARISTOR




(CAPACITORS)

C1A PSCU2JW221KR 2 20P

C1B PSCU2JW221KR 2 20P

C1C PSCU2JW221KR 2 20P

C2A ECUV1C474ZFV 0 .47

C2B ECUV1C474ZFV 0 .47

C2C ECUV1C474ZFV 0 .47C3A ECQE2E105KZ 1 S

C3B ECQE2E105KZ 1 S

C3C ECQE2E105KZ 1 S

C4A ECUV1C474ZFV 0 .47

C4B ECUV1C474ZFV 0 .47

C4C ECUV1C474ZFV 0 .47

C5A F2G1H1000010 10

C5B F2G1H1000010 10

C5C F2G1H1000010 10

C6A F2G1H1000010 10

C6B F2G1H1000010 10

C6C F2G1H1000010 10

C 8A E CU V1 H1 02 KB V 0. 00 1

C 8B E CU V1 H1 02 KB V 0. 00 1

C 8C E CU V1 H1 02 KB V 0. 00 1

C10A ECUV1H101JCV 100P

C10B ECUV1H101JCV 100P

C10C ECUV1H101JCV 100P

C11A ECUV1C683KBV 0.068

C11B ECUV1C683KBV 0.068

C11C ECUV1C683KBV 0.068














63



64/289

Ref.

No.










C23A ECUV1H223KBV 0.022 S

C23B ECUV1H223KBV 0.022 S

C23C ECUV1H223KBV 0.022 S







C26A ECUV1H103KBV 0.01

C26B ECUV1H103KBV 0.01

C26C ECUV1H103KBV 0.01

C100 ECUV1H223KBV 0.022 S

C101 ECUV1C333KBV 0.033


C103 ECUV1H223KBV 0.022 SC200A ECUV1H103KBV 0.01



C200D ECUV1H103KBV 0.01

C200E ECUV1H103KBV 0.01

C200F ECUV1H103KBV 0.01

C200G ECUV1H103KBV 0.01

C200H ECUV1H103KBV 0.01







C201G ECUV1H103KBV 0.01C201H ECUV1H103KBV 0.01

C202A F2G1C1000015 10

C202B F2G1C1000015 10

C202C F2G1C1000015 10

C202D F2G1C1000015 10

C202E F2G1C1000015 10

C202F F2G1C1000015 10

C202G F2G1C1000015 10

C202H F2G1C1000015 10

C203A F2G1C1000015 10

C203B F2G1C1000015 10

C203C F2G1C1000015 10

C203D F2G1C1000015 10

C203E F2G1C1000015 10

C203F F2G1C1000015 10

C203G F2G1C1000015 10

C203H F2G1C1000015 10

C204A F2G1H2R20005 2.2

C204B F2G1H2R20005 2.2

C204C F2G1H2R20005 2.2

C204D F2G1H2R20005 2.2

C204E F2G1H2R20005 2.2

C204F F2G1H2R20005 2.2

C204G F2G1H2R20005 2.2

C204H F2G1H2R20005 2.2

C 20 5A P SC EA 1H N4 R7 4. 7

C 20 5B P SC EA 1H N4 R7 4. 7

C 20 5C P SC EA 1H N4 R7 4. 7

C 20 5D P SC EA 1H N4 R7 4. 7

C 20 5E P SC EA 1H N4 R7 4. 7

C 20 5F P SC EA 1H N4 R7 4. 7

C 20 5G P SC EA 1H N4 R7 4. 7

C 20 5H P SC EA 1H N4 R7 4. 7

C206A ECUV1C393KBV 0.039 S

Ref.

No.


C206B ECUV1C393KBV 0.039 S

C206C ECUV1C393KBV 0.039 S

C206D ECUV1C393KBV 0.039 S

C206E ECUV1C393KBV 0.039 S

C206F ECUV1C393KBV 0.039 S

C206G ECUV1C393KBV 0.039 S

C206H ECUV1C393KBV 0.039 S









C208A F2G1H1R00013 1

C208B F2G1H1R00013 1

C208C F2G1H1R00013 1

C208D F2G1H1R00013 1

C208E F2G1H1R00013 1

C208F F2G1H1R00013 1

C208G F2G1H1R00013 1

C208H F2G1H1R00013 1

C209 ECUV1H223KBV 0.022 SC209A ECUV1H103KBV 0.01














C210G ECUV1H103KBV 0.01C210H ECUV1H103KBV 0.01

C 21 1 F 1J 1E 10 5A 00 8 1

C214 ECJ1VB0J225 2.2

C600 ECUV1C473KBV 0.047

C601 ECUV1C683KBV 0.068

C 60 2 E CU V1 C1 04 KB V 0 .1

C 60 3 E CU V1 C1 04 KB V 0 .1



C606 ECUV1H332KBV 0.0033

C607 ECUV1H682KBV 0.0068 S

C608 EEUFC1E101S 100


C610 ECUV1H102KBV 0.001

C 61 2 E CU V1 C1 04 KB V 0 .1

C615 ECUV1H471JCV 470P S

C 61 6 E CU V1 C1 04 KB V 0 .1

C618 ECUV1C563KBV 0.056

C619 ECUV1C563KBV 0.056


C 62 1 E CU V1 C1 04 KB V 0 .1


C 62 3 E CU V1 C1 04 KB V 0 .1




C 62 7 E CU V1 C1 04 KB V 0 .1

C628 ECUV1C223KBV 0.022

C629 ECUV1C223KBV 0.022

C630 ECUV1C223KBV 0.022

C631 ECUV1C223KBV 0.022

C 63 4 E CU V1 C1 04 KB V 0 .1

C 63 5 E CU V1 C1 04 KB V 0 .1

C 63 6 E CU V1 C1 04 KB V 0 .1

64



65/289

Ref.

No.


C 63 7 E CU V1C 10 4K BV 0. 1

C640 ECUV1C105KB 1 S






C646 ECUV1C563KBV 0.056

C647 ECUV1C563KBV 0.056

C648 ECUV1C563KBV 0.056

C649 ECUV1C563KBV 0.056

C650 ECUV1H562KBV 0.0056

C651 ECUV1H562KBV 0.0056





C 65 6 E CU V1C 10 4K BV 0. 1

C 65 7 E CU V1C 10 4K BV 0. 1

C658 PSCUV2EW223K 0.022 S

C 65 9 E CU V1C 10 4K BV 0. 1

C 66 0 E CU V1C 10 4K BV 0. 1


C 66 2 E CU V1C 10 4K BV 0. 1C663 ECUV1H223KBV 0.022 S











C675 ECUV1H152KBV 0.0015

C676 ECUV1H822KBV 0.0082 S

C 67 7 E CU V1C 10 4K BV 0. 1

C 67 9 E CU V1C 10 4K BV 0. 1C 68 0 E CU V1C 10 4K BV 0. 1

C 68 1 E CU V1C 10 4K BV 0. 1


C 68 3 E CU V1C 10 4K BV 0. 1


C 68 5 E CU V1C 10 4K BV 0. 1




C 70 3 F 1J 1E1 05 A0 08 1

C704 ECUV1C474ZFV 0.47

C705 ECEA1HN2R2S 2.2

C 70 7 E CU V1A 10 5Z FV 1

C708 ECUV1C823KBV 0.082

C709 ECUV1C823KBV 0.082

C 71 0 E CU V1C 10 4Z FV 0. 1



C 71 3 E CU V1H 18 0J CV 18 P

C 71 4 E CU V1H 22 0J CV 22 P


C716 ECJ1VB0J225 2.2

C 71 7 F 1J 1E1 05 A0 08 1

C718 ECUV1C224ZFV 0.22

C719 ECUV1H103KBV 0.01

C 72 0 E CU V1H 33 0J CV 33 P

C721 ECUV1H050CCV 5P S

C 72 2 E CU V1C 10 4K BV 0. 1

C 72 3 E CU

Documents

Tes Tem824la(Service)