12
High Design Technology Z U K E N R E D A C ZUKEN-REDAC TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS E. Leroux, R. Ene F. Maggioni CEM COMPO 99 - TOULOUSE - 14, 15 Janvier 1999 High Design Technology

TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

Embed Size (px)

Citation preview

Page 1: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

TECHNIQUES DE MODELISATION POUR LES

COMPOSANTS ACTIFS

E. Leroux, R. Ene

F. Maggioni

CEM COMPO 99 - TOULOUSE - 14, 15 Janvier 1999

High

Design

Technology

Page 2: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

INDEX

•INTRODUCTION

•DISPERSION OF ELECTRICAL PARAMETERS OF

COMPONENTS

•A MODELLING METHOD BASED ON TDR

•A MORE COMPLETE MODEL

•CONCLUSION, A METHODOLOGY IS PROPOSED

Page 3: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

INTRODUCTION

In EMC simulation of Printed Circuit Boards

•Need of realistic models for components

You have:

•SPICE, IBIS

But:

•Components suffer from dispersion of their electrical

parameters

Solution:

•A modelling methodology well adapted to EMC & high

speed designs

Page 4: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

DISPERSION OF ELECTRICAL PARAMETERS

OF COMPONENTS

•Unloaded output voltage

•Rise & fall times

•Clamping diodes

•Input threshold

•Input or output capacitances

Page 5: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

A MODELLING METHOD BASED ON TDR:

description

TDR

BIAS

DUTlaunchcable

biasprobe

power supply

controllaunch cable

DUT

gnd plane

gnd

connection

power supply

decoupling capacitor

bias

bias probe

Page 6: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.60TIME[nS]

-1

-0.8

-0.6

-0.4

-0.2

0

0.2

0.4

0.6

0.8

1RHO

A

B

C

D

A MODELLING METHOD BASED ON TDR:

CMOS input

Page 7: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

Pvdd

Pgnd

VDD 10

GND 20

1 Tin

Z0,Td

Bin

STF Vout

Vin

2

0

0

1

5

E1

+

A MODELLING METHOD BASED ON TDR:

CMOS input

Page 8: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

A MODELLING METHOD BASED ON TDR:

CMOS output

Vcontrol

R( )

1

1K

1M

5 2.5

sw2 sw1

DTF

t

DTF

STF

Vout

Vin

1

Vout

Vout

Z0,Td

E2

20 GND internal

2

Boutsw2

sw1

Pvdd

Pgnd

t

E1

10 VDD internal

Page 9: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

0.01 0.11 0.21 0.31 0.41 0.51 0.60 0.70 0.80 0.90 1.00

FREQ[GHz]

-100.00

-90.00

-80.00

-70.00

-60.00

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

10.00

dBV

IBIS-like

model

Enhanced

model

measured

Validity limit for

IBIS-like model

Validity limit for

Enhanced model

Comparison between an IBIS-like and an enhanced

model

Page 10: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

A MORE COMPLETE MODEL

component

power rail

ground rail

core

package

Page 11: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

Example of special component model

AC02 (four NOR):

1 2 3 4 5 6 7

gnd

vcc

standard

receiver model 8 9 10 11 12 13 14

R

1V

0V

Delay

Delay

Delay

2

3

1

Single NOR model

Four NOR models

A B OUT

0 0 1

1 0 0

0 1 0

1 1 0 standard driver model pin crosstalk

model

. . .

timing/logic core

Page 12: TECHNIQUES DE MODELISATION POUR LES COMPOSANTS ACTIFS

High

Design

Technology

Z U K E N

R E D A C

ZUKEN-REDAC

CONCLUSION & PROPOSAL FOR AN

INDUSTRIAL USE OF THE METHODOLOGY

A modelling method permits to avoid the dispersion of certain electrical

parameters of components and can be used by all HDT tools and THRIS

environnement

•But it can not be applied to all components placed on an industrial

board

Solution: a methodology that

•use standard library, SPICE or IBIS models for most of components

on the board

•build enhanced models (improving existing IBIS models for

example) for critical components

•using Models provider (HDT for example)